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公开(公告)号：US08636406B2
公开(公告)日：2014-01-28
申请号：US13445641
申请日：2012-04-12
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.
摘要翻译： 设备确定用于从电子设备传送热量的操作冷却装置的冷却特性。 操作冷却装置热耦合到热管。 热管具有用于选择性地在其上施加热量的暴露表面。 来自局部热源的热量被选择性地施加到暴露表面的至少一个区域。 热源优选能够相对于暴露的表面和热强度在位置上都变化。 优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与来自局部热源的热隔离。 当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。 然后将温度分布用于热操作冷却装置的特征。
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公开(公告)号：US08029186B2
公开(公告)日：2011-10-04
申请号：US10982575
申请日：2004-11-05
IPC分类号： G01K3/00
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.
摘要翻译： 所公开的是用于确定用于从电子设备传递热量的冷却装置的冷却特性的装置。 该装置包括热耦合到热管的冷却装置。 该热管具有用于选择性地在其上施加热量的暴露表面。 选择性地将局部热源施加到暴露表面的至少一个区域。 热源优选地能够相对于暴露的表面和热强度都在位置上变化。 优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与局部热源隔离。 当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。 然后使用温度分布来热定形冷却装置。
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公开(公告)号：US07366632B2
公开(公告)日：2008-04-29
申请号：US11195426
申请日：2005-08-02
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
IPC分类号： G01K1/06
CPC分类号： G01K1/026 , G01K2213/00
摘要： An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.
摘要翻译： 公开了一种用于在操作期间测量数据中心的物理量的装置和方法以及用于维护大规模计算系统的方法。 该装置包括支撑多个传感器的推车。 购物车可在数据中心内移动。 传感器捕获房间内的温度或其他物理参数。 传感器读数以及与推车相关的位置和方向信息被传送到计算机系统，在该系统中分析数据以选择数据中心的最佳温度或其他系统环境参数。
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公开(公告)号：US20080087825A1
公开(公告)日：2008-04-17
申请号：US11519393
申请日：2006-09-12
IPC分类号： G01J5/02
CPC分类号： G01Q60/22
摘要： A high resolution material observation system includes an object having at least one spatial dimension sufficient to support production of near-field infrared emissions, a holder adapted to receive a sample to be observed, the holder further adapted to position the sample in the near-field infrared emissions, and a thermal excitation unit, adapted to be thermally coupled to at least one of the object and the sample. The thermal excitation unit is further adapted to causing black body radiation in either the object or the sample within the infrared spectrum.
摘要翻译： 高分辨率材料观察系统包括具有足以支持近场红外发射的产生的至少一个空间尺寸的物体，适于接收待观察的样品的保持器，所述保持器还适于将样品定位在近场 红外发射和热激发单元，适于热耦合到物体和样品中的至少一个。 热激发单元还适于在红外光谱内的物体或样品中引起黑体辐射。
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公开(公告)号：US08038343B2
公开(公告)日：2011-10-18
申请号：US12048635
申请日：2008-03-14
IPC分类号： G01K3/00
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： A novel computer program product and method for thermally characterizing a device used for cooling an electronic device is disclosed. A cooling device, being operated, is thermally coupled to a heat pipe having a surface to receive a test chip. A heater is patterned on a circuitry side of the test chip. The heater is separate from operational circuitry of the test chip. A localized heat source is applied to at least one region on a test chip thermally coupled to the heat pipe to locally heat more than one region on a second surface of the test chip to test more than one hot spot. The second surface is the circuitry side of the test chip. The heater provides a bias heat to the test chip, independent of operating the test chip, while the localized heat source is selectively applied directly to the test chip. A temperature detector is used to measure a temperature distribution on the second surface of the test chip. The temperature distribution is used to thermally characterize said cooling device during operation.
摘要翻译： 公开了一种用于热表征用于冷却电子设备的设备的新颖的计算机程序产品和方法。 被操作的冷却装置热耦合到具有接收测试芯片的表面的热管。 加热器在测试芯片的电路侧进行图案化。 加热器与测试芯片的操作电路分开。 将局部热源施加到热耦合到热管的测试芯片上的至少一个区域，以局部加热测试芯片的第二表面上的多于一个区域，以测试多于一个热点。 第二个表面是测试芯片的电路侧。 加热器对测试芯片提供偏置热量，与操作测试芯片无关，同时局部热源被选择性地直接应用于测试芯片。 温度检测器用于测量测试芯片第二表面上的温度分布。 温度分布用于在操作期间热定形所述冷却装置。
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16.发明授权公开(公告)号：US07739073B2
公开(公告)日：2010-06-15
申请号：US12110732
申请日：2008-04-28
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
CPC分类号： G01K1/026 , G01K2213/00
摘要： An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.
摘要翻译： 公开了一种用于在操作期间测量数据中心的物理量的装置和方法以及用于维护大规模计算系统的方法。 该装置包括支撑多个传感器的推车。 购物车可在数据中心内移动。 传感器捕获房间内的温度或其他物理参数。 传感器读数以及与推车相关的位置和方向信息被传送到计算机系统，在该系统中分析数据以选择数据中心的最佳温度或其他系统环境参数。
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公开(公告)号：US20100046574A1
公开(公告)日：2010-02-25
申请号：US12611519
申请日：2009-11-03
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.
摘要翻译： 所公开的是用于确定用于从电子设备传递热量的冷却装置的冷却特性的装置。 该装置包括热耦合到热管的冷却装置。 该热管具有用于选择性地在其上施加热量的暴露表面。 选择性地将局部热源施加到暴露表面的至少一个区域。 热源优选地能够相对于暴露的表面和热强度都在位置上变化。 优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与局部热源隔离。 当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。 然后使用温度分布来热定形冷却装置。
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公开(公告)号：US06928380B2
公开(公告)日：2005-08-09
申请号：US10699123
申请日：2003-10-30
CPC分类号： G01K1/026
摘要： A system and method for measuring thermal distributions of an electronic device during operation is disclosed. The system includes an electronic device, a heat sink adjacent to the electronic device and an electrical-insulating layer disposed on the electronic device so as to separate the electronic device and the heat sink. The system further includes a plurality of thermal sensors located on the electrical-insulating layer, each of the plurality of thermal sensors in a different location. The plurality of thermal sensors is located within one or more thin film circuit layers disposed adjacent to the electrical insulating layer. The system further includes a module for receiving thermal information from the plurality of thermal sensors during operation of the electronic device. The system further includes a processor coupled to the module for generating a thermal distribution of the electronic device based on the thermal information received from the plurality of thermal sensors.
摘要翻译： 公开了一种用于测量操作期间电子设备的热分布的系统和方法。 该系统包括电子设备，与电子设备相邻的散热器以及设置在电子设备上以分离电子设备和散热器的电绝缘层。 该系统还包括位于电绝缘层上的多个热传感器，多个热传感器中的每一个处于不同的位置。 多个热传感器位于邻近电绝缘层设置的一个或多个薄膜电路层内。 该系统还包括用于在电子设备的操作期间从多个热传感器接收热信息的模块。 该系统还包括耦合到模块的处理器，用于基于从多个热传感器接收的热信息产生电子设备的热分布。
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公开(公告)号：US08283636B2
公开(公告)日：2012-10-09
申请号：US13443062
申请日：2012-04-10
IPC分类号： G01J5/02
CPC分类号： G01Q60/22
摘要： A high resolution material observation system includes an object having at least one spatial dimension sufficient to support production of near-field infrared emissions, a holder adapted to receive a sample to be observed, the holder further adapted to position the sample in the near-field infrared emissions, and a thermal excitation unit, adapted to be thermally coupled to at least one of the object and the sample. The thermal excitation unit is further adapted to causing black body radiation in either the object or the sample within the infrared spectrum.
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公开(公告)号：US08210741B2
公开(公告)日：2012-07-03
申请号：US12611519
申请日：2009-11-03
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.
摘要翻译： 设备确定用于从电子设备传送热量的操作冷却装置的冷却特性。 操作冷却装置热耦合到热管。 热管具有用于选择性地在其上施加热量的暴露表面。 来自局部热源的热量被选择性地施加到暴露表面的至少一个区域。 热源优选能够相对于暴露的表面和热强度在位置上都变化。 优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与来自局部热源的热隔离。 当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。 然后将温度分布用于热操作冷却装置的特征。
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