公开(公告)号：US20220321196A1

公开(公告)日：2022-10-06

申请号：US17658059

申请日：2022-04-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongwon LEE ,  Daehee PARK ,  Chonghwa SEO

IPC: H04B7/08 ,  H04B17/309 ,  H04B7/06

Abstract: A method is performed by an electronic device that includes antenna modules AM1 and AM2. The method includes: while transmitting or receiving through AM1, receiving a specified wireless signal through AM1 and AM2; identifying a first signal quality for the specified wireless signal of AM1 and a second signal quality for the specified wireless signal of AM2; and in response to determining that a difference between the first signal quality and the second signal quality is within a specified signal quality range and that a rank of a wireless channel through which the specified wireless signal is received is two or more, selecting an antenna module to transmit or receive a wireless signal, from among AM1 and AM2, based on first channel information about AM1 and second channel information about AM2. The method includes transmitting or receiving the wireless signal using the selected antenna module.

公开(公告)号：US20210091450A1

公开(公告)日：2021-03-25

申请号：US17025096

申请日：2020-09-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungmin PARK ,  Chonghwa SEO ,  Dongil SON ,  Jongwon LEE ,  Sangwon HA

IPC: H01Q1/02 ,  H01Q21/00 ,  H01Q1/22 ,  H01Q1/38 ,  H05K1/02

Abstract: An electronic device is provided. The electronic device includes a housing, an antenna module disposed along an inner wall of the housing, and a heat dissipation member disposed inside the housing. The antenna module may include a first circuit board including a plurality of layers, wherein the plurality of layers include a plurality of conductive layers and a plurality of non-conductive layers, and the conductive layer and the non-conductive layer are alternately stacked, at least one integrated circuit mounted on the first circuit board, an antenna array disposed on any one of the plurality of layers and electrically coupled with the at least one integrated circuit, and a heat transfer member including a conductive member extending from any one conductive layer among the plurality of conductive layers and a non-conductive member surrounding, at least in part, the conductive member.