公开(公告)号：US20140024786A1

公开(公告)日：2014-01-23

申请号：US13944283

申请日：2013-07-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Hee SOHN ,  Sang Soo LEE ,  Jae Jun LEE ,  Hyun Jeong JEON

IPC: C08G73/10

CPC classification number: C08G73/1067 ,  C08G73/1039

Abstract: Disclosed are a polyimide precursor composition that includes a polyamic acid selected from compounds represented by Chemical Formulae 1 to 3, and a combination thereof; and a cross-linking agent selected from a compound represented by Chemical Formula 4, a compound represented by Chemical Formula 5, and a combination thereof; an article including a cross-linked polyimide using the same; and a display device including the article.

Abstract translation: 公开了一种聚酰亚胺前体组合物，其包含选自化学式1至3表示的化合物的聚酰胺酸及其组合; 和选自化学式4表示的化合物，化学式5表示的化合物及其组合的交联剂; 包括使用其的交联聚酰亚胺的制品; 以及包括该物品的显示装置。