SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20230082004A1

    公开(公告)日:2023-03-16

    申请号:US17874527

    申请日:2022-07-27

    Abstract: A method for manufacturing a semiconductor package includes forming a pad pattern including a metal film on a semiconductor chip; forming an insulating layer covering the pad pattern and including an organic insulating material; and forming an opening exposing a surface of the metal film of the pad pattern by performing laser processing on the insulating layer, wherein, in forming the opening, a region to be plastically deformed on the metal film by the laser processing is formed.

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