ELECTRONIC DEVICE COMPRISING BIOMETRIC AUTHENTICATION DEVICE, AND METHOD FOR OPERATING SAME

    公开(公告)号:US20230065478A1

    公开(公告)日:2023-03-02

    申请号:US17975252

    申请日:2022-10-27

    Inventor: Seonho LEE

    Abstract: An electronic device includes a biometric authentication device; a memory configured to store an application and one or more instructions; and at least one processor configured to execute the one or more instructions to: receive an input for executing the application; based on receiving the input for executing the application, begin launching the application by loading public content corresponding to the application; operate the biometric authentication device to perform a biometric authentication while the public content is loaded; and based on the biometric authentication device completing the biometric authentication, complete the launching of the application by loading the public content and dedicated content associated with the biometric authentication.

    METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

    公开(公告)号:US20210343569A1

    公开(公告)日:2021-11-04

    申请号:US17111758

    申请日:2020-12-04

    Abstract: To manufacture a semiconductor package, a package intermediate structure having an element area and a dummy area is formed. A carrier substrate including an adhesion layer is formed. The adhesion layer includes a first area with a first adhesion strength and a second area with a second adhesion strength that is different from the first adhesion strength. The package intermediate structure is supported by the carrier substrate so that the element area is adjacent the first area and the dummy area is adjacent the second area. The package intermediate structure is processed while the package intermediate structure is supported by the carrier substrate.

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