公开(公告)号：US20210041912A1

公开(公告)日：2021-02-11

申请号：US16903738

申请日：2020-06-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kihun EOM ,  Kihoon KANG ,  Taekeun KIM ,  Sunghun SHIN ,  Kyeongmun JO

IPC: G06F1/16 ,  H04M1/02

Abstract: Various embodiments provide a device and method for detecting a folding angle of an electronic device. The electronic device includes: a first housing structure connected to a hinge structure; a second housing structure folded about the hinge structure relative to the first housing structure; a first motion sensor module disposed in the first housing structure; a second motion sensor module disposed in the second housing structure; a magnetic force sensor module disposed in the first housing structure; a magnetic body disposed in the second housing structure; and at least one processor. The at least one processor is configured to: identify a folded first angle between the first housing structure and the second housing structure based on the first motion sensor module and the second motion sensor module, and a first index associated with a state of the first angle, identify a folded second angle between the first housing structure and the second housing structure based on the magnetic force sensor module, and a second index associated to a state of the second angle, and determine the folded angle between the first housing structure and the second housing structure based on at least one of the first angle or the second angle selected based on the first index and the second index.

公开(公告)号：US20200158752A1

公开(公告)日：2020-05-21

申请号：US16685449

申请日：2019-11-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kihun EOM ,  Kihoon KANG ,  Taekeun KIM

IPC: G01P15/18 ,  H04M1/725 ,  G01P15/08

Abstract: A method and an electronic device are provided for sensing an external shock applied to the electronic device. A method includes monitoring acceleration using a first sensor; generating an event based on the monitored acceleration; activating a second sensor based on the event; acquiring data due to external shocks on parts of the electronic device by using the activated second sensor; and storing the acquired data and information related to the external shocks.