公开(公告)号：US09363895B2

公开(公告)日：2016-06-07

申请号：US14249707

申请日：2014-04-10

Applicant: Seiko Epson Corporation

Inventor： Juichiro Matsuzawa ,  Masaru Mikami ,  Toshiya Usuda

IPC: H05K1/16 ,  H05K1/18 ,  H03H9/215 ,  H05K1/02 ,  H03H9/05

CPC classification number: H05K1/18 ,  H03H9/0509 ,  H03H9/0542 ,  H03H9/0552 ,  H03H9/215 ,  H05K1/0268 ,  H05K2203/162 ,  Y10T29/49004

Abstract: A circuit substrate includes a base substrate provided with a first pad and a second pad which are electrically connected to an electronic component, a first lateral face and a second lateral face, a first terminal electrically connected to the first pad and a second terminal electrically connected to the second pad which are disposed on the first lateral face, and a third terminal and a fourth terminal which are disposed on the second lateral face. The first terminal and the fourth terminal are located at point-symmetric positions to a center of the base substrate. The second terminal and the third terminal are located at point-symmetric positions to the center of the base substrate. The third terminal and the fourth terminal are electrically connected to each other.

Abstract translation: 电路基板包括设置有电连接到电子部件的第一焊盘和第二焊盘的基板，第一侧面和第二侧面，电连接到第一焊盘的第一端子和电连接的第二端子 设置在第一侧面上的第二焊盘和设置在第二侧面上的第三端子和第四端子。 第一端子和第四端子位于基底基板的中心的点对称位置。 第二端子和第三端子位于基底衬底的中心的点对称位置。 第三端子和第四端子彼此电连接。