公开(公告)号：US10910500B2

公开(公告)日：2021-02-02

申请号：US15895513

申请日：2018-02-13

Applicant: STMicroelectronics S.r.l.

Inventor： Mohammad Abbasi Gavarti ,  Daniele Caltabiano ,  Marco Omar Ghidoni

IPC: H01L29/84 ,  H01L23/00 ,  H01L23/06 ,  H01L29/16 ,  H01L23/10 ,  H01L29/06 ,  G01L1/18 ,  H01L23/047

Abstract: In an embodiment of the present invention, a load sensor package includes a housing having a cap, a column, a peripheral structure, and a base. The base includes a major surface configured to mount a stress sensor, while the cap includes a cap major surface configured to receive a load to be measured. The column is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor. The peripheral structure is configured to transfer the remaining fraction of the load to be measured to the base.