公开(公告)号：US20180194131A1

公开(公告)日：2018-07-12

申请号：US15917231

申请日：2018-03-09

Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS (MALTA) LTD

Inventor： Simon DODD ,  Ivan ELLUL ,  Christopher BRINCAT

IPC: B41J2/01 ,  B41J2/14 ,  B41J2/045

CPC classification number: B41J2/01 ,  B41J2/04548 ,  B41J2/14072 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2002/14362 ,  B41J2002/14491

Abstract: One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.

公开(公告)号：US20170190175A1

公开(公告)日：2017-07-06

申请号：US15253618

申请日：2016-08-31

Applicant: STMICROELECTRONICS, INC.

Inventor： Simon DODD

IPC: B41J2/14

CPC classification number: B41J2/14072 ,  B41J2/14201 ,  B41J2/1753 ,  B41J2/17553 ,  B41J2002/14362 ,  B41J2002/14491

Abstract: The present disclosure provides supports for a microfluidic die and one or more additional die including, but not limited to, microfluidic die, ASICs, MEMS devices, and sensors. This includes semi-flexible supports that allow a microfluidic die to be at a 90 degree angle with respect to another die and rigid supports that allow a microfluidic and another die to be in close proximity to each other.

公开(公告)号：US20190053442A1

公开(公告)日：2019-02-21

申请号：US16168746

申请日：2018-10-23

Applicant: STMicroelectronics, Inc.

Inventor： Marco DE FAZIO ,  Simon DODD

IPC: A01G25/02 ,  A01G31/02

Abstract: The present disclosure is directed to a greenhouse or single container for plant growth coupled to the Internet of Things and including a microfluidic die for water or nutrient distribution. The microfluidic die is controllable automatically or with instructions from a remote user, based on sensors included within a growth environment.

公开(公告)号：US20170188526A1

公开(公告)日：2017-07-06

申请号：US14985128

申请日：2015-12-30

Applicant: STMicroelectronics, Inc.

Inventor： Marco DE FAZIO ,  Simon DODD

IPC: A01G25/02 ,  G05B15/02

CPC classification number: A01G25/02 ,  A01G9/14 ,  A01G31/02 ,  G05B15/02 ,  G05B2219/2625 ,  Y02A40/252 ,  Y02P60/216

Abstract: The present disclosure is directed to a greenhouse or single container for plant growth coupled to the Internet of Things and including a microfluidic die for water or nutrient distribution. The microfluidic die is controllable automatically or with instructions from a remote user, based on sensors included within a growth environment.