公开(公告)号：US20230061430A1

公开(公告)日：2023-03-02

申请号：US17896692

申请日：2022-08-26

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Paolo FERRARI ,  Lorenzo CORSO ,  Flavio Francesco VILLA ,  Silvia NICOLI ,  Luca LAMAGNA

IPC: B81C1/00 ,  B81B7/02

Abstract: Method for manufacturing a micro-electro-mechanical system, MEMS, integrating a first MEMS device and a second MEMS device. The first MEMS device is a capacitive pressure sensor and the second MEMS device is an inertial sensor. The steps of manufacturing the first and second MEMS devices are, at least partly, shared with each other, resulting in a high degree of integration on a single die, and allowing to implement a manufacturing process with high yield and controlled costs.

公开(公告)号：US20160121607A1

公开(公告)日：2016-05-05

申请号：US14531830

申请日：2014-11-03

Applicant: STMicroelectronics S.r.l.

Inventor： Dino FARALLI ,  Laura Maria CASTOLDI ,  Paolo FERRARI ,  Marta CARMINATI

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1433 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1632 ,  B41J2/1642 ,  B41J2/1643

Abstract: Embodiments disclose herein are directed to a microfluidic delivery device that has a predominantly semiconductor structure, such as silicon. In particular, the structure for delivering fluid may be formed from polycrystalline silicon, also called polysilicon, or epitaxial silicon. The microfluidic delivery device that predominantly uses silicon based materials to form the structures that are in contact with the dispensed fluid results in a device that is compatible with a wide set of fluids and applications.

Abstract translation: 本文公开的实施方案涉及具有主要半导体结构（例如硅）的微流体递送装置。 特别地，用于输送流体的结构可以由也称为多晶硅的多晶硅或外延硅形成。 主要使用硅基材料以形成与分配的流体接触的结构的微流体递送装置导致与广泛流体和应用相容的装置。