公开(公告)号：US20190137427A1

公开(公告)日：2019-05-09

申请号：US16167165

申请日：2018-10-22

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Salvatore CASCINO ,  Antonello SANTANGELO

IPC: G01N27/12 ,  H05B3/02 ,  H05B3/10 ,  H05B3/20

Abstract: A micro-heater element for a MEMS sensor device, envisages, in a single conductive layer: an outer ring, defining inside it a window; a heat-diffusion structure, arranged within the window, separated from the outer ring by a first separation gap; and connection elements, arranged between the heat-diffusion structure and the outer ring, and designed to connect the heat-diffusion structure to the outer ring. The outer ring is designed to dissipate energy upon passage of an electric current, and the heat-diffusion structure is designed to distribute, within the micro-heater element, the heat that is transferred by the outer ring through the connection elements.