公开(公告)号：US10600704B2

公开(公告)日：2020-03-24

申请号：US16133065

申请日：2018-09-17

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Malta) Ltd

Inventor： Jerome Lopez ,  Roseanne Duca

IPC: H01L23/495 ,  H01L23/10 ,  H01L23/31 ,  H01L21/50 ,  H01L23/498

Abstract: A support substrate has a face above which at least one electronic component is fixed. A peripheral area of the face includes an annular local metal layer. An encapsulating cover for the electronic component includes a peripheral wall having an end edge that is mounted above the peripheral area. The annular metal local layer includes, at the periphery thereof, a series of spaced-apart teeth with notches formed therebetween. The teeth extend as far as the peripheral edge of the support substrate.