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公开(公告)号:US20220165759A1
公开(公告)日:2022-05-26
申请号:US17469217
申请日:2021-09-08
Applicant: Samsung Display Co., LTD.
Inventor: Kyung Jin JEON , So Young KOO , Eok Su KIM , Hyung Jun KIM , Yun Yong NAM , Jun Hyung LIM
Abstract: A display device and a method of manufacturing a display device are provided. The display device includes a first conductive layer on a substrate, a passivation layer disposed on the first conductive layer and exposing at least a part of the first conductive layer, a second conductive layer disposed on the passivation layer and covering an upper surface of the passivation layer, a via layer on the second conductive layer, a third conductive layer including a first electrode, a second electrode, and a connection pattern, and spaced apart from each other on the via layer, and a light emitting element having ends that are disposed on the first electrode and the second electrode, respectively. The connection pattern electrically connects the first conductive layer and the second conductive layer through a first contact hole penetrating the via layer.
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公开(公告)号:US20220115364A1
公开(公告)日:2022-04-14
申请号:US17471581
申请日:2021-09-10
Applicant: Samsung Display Co., LTD.
Inventor: Kyung Jin JEON , So Young KOO , Eok Su KIM , Hyung Jun KIM , Yun Yong NAM , Jun Hyung LIM
Abstract: A display device includes a first conductive layer disposed on a substrate, a passivation layer disposed on the first conductive layer, a second conductive layer disposed on the passivation layer, a via layer disposed on the second conductive layer, a third conductive layer disposed on the via layer, the third conductive layer including a first electrode, a second electrode, a connection pattern, the first electrode, the second electrode, and the connection pattern being spaced apart from each other, and a light emitting element, a first end and a second end of the light emitting element being disposed on the first electrode and the second electrode, respectively, wherein the connection pattern electrically connects the first conductive layer and the second conductive layer through a first contact hole penetrating the via layer and the passivation layer.
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