公开(公告)号：US20220118637A1

公开(公告)日：2022-04-21

申请号：US17402872

申请日：2021-08-16

Applicant: Samsung Display Co., Ltd.

Inventor： Chung-Seok Lee ,  Jeongeun Park ,  Hanho Park ,  Jeongmin Ban ,  Joongmok Lee ,  Soyeon Joo

IPC: B26D1/04 ,  B26D7/10 ,  B26D7/08 ,  G06F1/18

Abstract: A film cutting device includes a stage which supports a circuit film, a cutter disposed on the stage to cut the circuit film, a vibration horn connected to the cutter, where the vibration horn vibrates the cutter in a first direction based on an ultrasonic wave, and a cooler which cools the cutter.

公开(公告)号：US20220085120A1

公开(公告)日：2022-03-17

申请号：US17210518

申请日：2021-03-24

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： JOONGMOK LEE ,  Jeongeun Park ,  Hanho Park ,  Chung-Seok Lee ,  Soyeon Joo

IPC: H01L27/32 ,  H05K1/18

Abstract: A display device includes a display panel including a plurality of display pads at least some of which at least a portion extend in a first direction and are arranged in a second direction intersecting the first direction, and a flexible circuit board including circuit pads, at least some of which at are electrically connected to the display pads, and circuit lines connected to the circuit pads. The circuit pads include at least one dummy pad, and the circuit lines include a dummy circuit line, of which at least a portion of is connected to the at least one dummy pad. The dummy circuit line includes a first portion connected to the at least one dummy pad and a second portion spaced apart from the first portion by a gap.

公开(公告)号：US20210116734A1

公开(公告)日：2021-04-22

申请号：US17137283

申请日：2020-12-29

Applicant: Samsung Display Co., Ltd.

Inventor： Sujeong Kim ,  Hanho Park ,  Sangwon Yeo ,  Daegeun Lee ,  Joonsam Kim

IPC: G02F1/1345 ,  H01L23/00 ,  H01L27/32 ,  H01L51/00

Abstract: A display device including a display panel including a base layer, a circuit layer disposed on the base layer, and a pad part having a plurality of pads disposed on the base layer; and a driving chip disposed on the pad part and including a plurality of chip pads. The plurality of pads include a first pad having a smaller area than a corresponding chip pad among the plurality of chip pads and a second pad electrically connected to the circuit layer.