DEVICE AND METHOD FOR MEASURING THICKNESS
    11.
    发明公开

    公开(公告)号:US20240159515A1

    公开(公告)日:2024-05-16

    申请号:US18457548

    申请日:2023-08-29

    CPC classification number: G01B11/06

    Abstract: A thickness measuring device includes an imaging unit disposed above an inspection substrate, which includes a substrate, a pattern provided on the substrate, and an inspection layer disposed on the pattern. The imaging unit images the inspection substrate to output inspection image data and a data calculating unit receives the inspection image data and calculates a thickness value of the inspection layer from the inspection image data, wherein the imaging unit is disposed inclined at a fixed angle with respect to the inspection substrate, and wherein the data calculating unit calculates the thickness value of the inspection layer using a coordinate value of the pattern from the inspection image data.

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