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公开(公告)号:US20240159515A1
公开(公告)日:2024-05-16
申请号:US18457548
申请日:2023-08-29
Applicant: Samsung Display Co., LTD.
Inventor: OHJUNE KWON , JINHO HYUN
IPC: G01B11/06
CPC classification number: G01B11/06
Abstract: A thickness measuring device includes an imaging unit disposed above an inspection substrate, which includes a substrate, a pattern provided on the substrate, and an inspection layer disposed on the pattern. The imaging unit images the inspection substrate to output inspection image data and a data calculating unit receives the inspection image data and calculates a thickness value of the inspection layer from the inspection image data, wherein the imaging unit is disposed inclined at a fixed angle with respect to the inspection substrate, and wherein the data calculating unit calculates the thickness value of the inspection layer using a coordinate value of the pattern from the inspection image data.
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公开(公告)号:US20240099117A1
公开(公告)日:2024-03-21
申请号:US18217538
申请日:2023-07-01
Applicant: Samsung Display Co., LTD.
Inventor: SEUNGWOOK KWON , HEECHANG YOON , JINHO HYUN , OHJUNE KWON , HYOJEONG KWON , SEUNGGUN CHAE , SEUNG-YEON CHAE , Sangyeon Hwang
CPC classification number: H10K71/40 , H10K59/1201 , H10K59/873
Abstract: A method of manufacturing a display device includes providing an encapsulation layer on a display panel, providing an uncured resin layer on the encapsulation layer and forming a protective layer by curing the uncured resin layer in a nitrogen atmosphere having an oxygen concentration in a range of about 300 ppm to about 10000 ppm.
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公开(公告)号:US20220078926A1
公开(公告)日:2022-03-10
申请号:US17335709
申请日:2021-06-01
Applicant: Samsung Display Co., Ltd.
Inventor: OHJUNE KWON , CHANHO MOON , JUNGHAN SEO , SUNGHOON YANG
Abstract: A display device includes a support member including a through-hole, a polymer film disposed above a support member, a display panel disposed above a polymer film, a protective layer disposed above a display panel, and an electronic module. The polymer film includes a protrusion portion protruding toward the support member. The electronic module is disposed in a position corresponding to the through-hole and facing the protrusion portion.
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