-
公开(公告)号:US20220278088A1
公开(公告)日:2022-09-01
申请号:US17626198
申请日:2020-06-26
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Chan Jae PARK , Sang Duk LEE , Hyun A LEE , Dae Hwan JANG
Abstract: A display panel comprising a display substrate having a display area and a pad area disposed around the display area. A connection wire is disposed on the pad area of the display substrate. A signal wire is disposed on the connection wire. A supporter is disposed between the display substrate and the connection wire. The connection wire directly contacts the supporter.
-
公开(公告)号:US20210357060A1
公开(公告)日:2021-11-18
申请号:US17278244
申请日:2019-07-08
Applicant: Samsung Display Co., Ltd.
Inventor: Byoung Yong KIM , Seung Yong SONG , Seung Soo RYU , Dae Geun LEE , Sang Duk LEE
Abstract: A display device includes: a display region; a non-display region surrounding the display region; a first substrate; a second substrate on the first substrate, and including a first surface facing the first substrate, and a second surface opposite to the first surface; a touch electrode on the second surface of the second substrate at the display region; a touch pad terminal on the second surface of the second substrate at the non-display region, and electrically connected to the touch electrode; and a sealing member interposed between the first substrate and the second substrate, and connecting the first substrate and the second substrate to each other. The sealing member is at the non-display region, and the touch pad terminal is located more inward than the sealing member.
-
公开(公告)号:US20210200006A1
公开(公告)日:2021-07-01
申请号:US17267966
申请日:2019-02-08
Applicant: Samsung Display Co., LTD.
Inventor: Seung Soo RYU , Byoung Yong KIM , Sang Duk LEE
IPC: G02F1/1345 , G02F1/1333 , G02F1/1339
Abstract: A display device according to an embodiment includes a first substrate including a connection line; a second substrate facing the first substrate; and a connection pad connected to a side of surface of the first substrate and a side surface of the second substrate, wherein the connection pad includes a first portion contacting the side of the first substrate and the side surface of the second substrate, and a second portion that is disposed in each of the first substrate and the second substrate and contacting the connection wiring.
-
-