公开(公告)号：US10825140B1

公开(公告)日：2020-11-03

申请号：US16826851

申请日：2020-03-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heechul Yang ,  Jongseok Lee ,  Youngo Park ,  Kwangpyo Choi

IPC: G06T3/40 ,  G06N3/04 ,  G06F7/544

Abstract: Provided are methods and apparatus related to Artificial Intelligence (AI) downscaling and upscaling and techniques related to reducing artifact problems. Some embodiments include down-scaling an original image through a Deep Neural Network (DNN); generating, from the original image and based on frequency transform coefficients, artifact information representing a region in the first image including an artifact in the first image. Post-processing may be performed based on the artifact information to change pixels in the first image, thus reducing the effect of artifacts.

公开(公告)号：US10817990B1

公开(公告)日：2020-10-27

申请号：US16850411

申请日：2020-04-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heechul Yang ,  Jongseok Lee ,  Youngo Park ,  Kwangpyo Choi

IPC: G06T3/40 ,  G06N3/04 ,  G06F7/544

Abstract: Provided are methods and apparatus related to Artificial Intelligence (AI) downscaling and upscaling and techniques related to reducing artifact problems. Some embodiments include down-scaling an original image through a Deep Neural Network (DNN); generating, from the original image and based on frequency transform coefficients, artifact information representing a region in the first image including an artifact in the first image. Post-processing may be performed based on the artifact information to change pixels in the first image, thus reducing the effect of artifacts.