公开(公告)号：US11121090B2

公开(公告)日：2021-09-14

申请号：US16683960

申请日：2019-11-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changbo Lee ,  Joonseok Oh ,  Byunglyul Park

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: This invention provides a fan-out semiconductor package, the fan-out semiconductor package includes a frame including one or more insulating layers and having a penetration portion, a semiconductor chip disposed in the penetration portion of the frame and having a connection pad, a connection structure disposed on a lower side of the frame and the semiconductor chip and including a redistribution layer, a first encapsulant covering a back surface of the semiconductor chip and a first region of a top surface of an uppermost insulating layer among the one or more insulating layers of the frame and extending between a sidewall of the penetration portion and a side surface of the semiconductor chip, and a second encapsulant covering a second region of the top surface of the uppermost insulating layer among the one or more insulating layers of the frame and being in contact with a side surface of the first encapsulant on the frame.