公开(公告)号：US11289622B2

公开(公告)日：2022-03-29

申请号：US16832884

申请日：2020-03-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonsuk Lee ,  Sangmoo Park ,  Doyoung Kwag ,  Byungchul Kim ,  Eunhye Kim ,  Minsub Oh ,  Dongyeob Lee

IPC: H01L33/00 ,  H01L33/62

Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.

公开(公告)号：US11289462B2

公开(公告)日：2022-03-29

申请号：US16866027

申请日：2020-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Kwag ,  Byungchul Kim ,  Eunhye Kim ,  Sangmoo Park ,  Minsub Oh ,  Dongyeob Lee ,  Yoonsuk Lee

IPC: H01L25/13 ,  H01L33/00

Abstract: A display module is provided. The display module includes: a substrate; a thin film transistor (TFT) layer formed on one surface of the substrate; and a plurality of micro LEDs disposed on the TFT layer. The plurality of micro LEDs are transferred from a transfer substrate to the TFT layer by a laser beam radiated to the transfer substrate through openings of a mask. The openings correspond to regions in which the respective micro LEDs of the transfer substrate are arranged and the openings correspond to a width, a length, or a unit area of each of the micro LEDs.

公开(公告)号：US11063026B2

公开(公告)日：2021-07-13

申请号：US16808558

申请日：2020-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye Kim ,  Doyoung Kwag ,  Byungchul Kim ,  Sangmoo Park ,  Minsub Oh ,  Dongyeob Lee ,  Yoonsuk Lee

IPC: H01L25/075 ,  H01L33/62

Abstract: A method of manufacturing a display module is provided. The method may include providing a substrate including a pixel region on which a plurality of electrodes are disposed and a peripheral region that is a region other than the pixel region on the substrate; forming an adhesive layer on the pixel region of the substrate; transferring a plurality of micro light emitting diodes (LEDs) onto the adhesive layer; pre-curing the adhesive layer to shift the adhesive layer on the pixel region to the peripheral region; and bonding the plurality of micro LEDs to the plurality of electrodes.

公开(公告)号：US20200335659A1

公开(公告)日：2020-10-22

申请号：US16850645

申请日：2020-04-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangmoo PARK ,  Minsub Oh ,  Doyoung Kwag ,  Byungchul Kim ,  Eunhye Kim ,  Dongyeob Lee ,  Yoonsuk Lee

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/24

Abstract: A light-emitting diode (LED) transferring method is provided. The LED transferring method includes disposing a transfer substrate, on which a plurality of LEDs of different colors are sequentially arranged in at least one row or at least one column, between a target substrate and a laser oscillator, and simultaneously transferring the plurality of LEDs from the transfer substrate to predetermined points of the target substrate by radiating a laser beam toward the target substrate from the laser oscillator.