公开(公告)号：US20230208950A1

公开(公告)日：2023-06-29

申请号：US18083864

申请日：2022-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyihyun JANG ,  Gyusub KIM ,  Kyungmoon SEOL ,  Bumjin CHO ,  Seongyong AN ,  Chankyu AN ,  Jaebong CHUN ,  Nakchung CHOI

IPC: H04M1/02 ,  H01Q1/24 ,  H01Q9/04 ,  H03H7/38

CPC classification number: H04M1/026 ,  H01Q1/243 ,  H01Q9/0442 ,  H03H7/38

Abstract: An electronic device includes a first housing, a second housing, a supporting member, at least one slit, and at least one processor. The second housing includes a plurality of conductive portions and a plurality of non-conductive portions. At least one processor is configured to communicate with an external electronic device through the housing and the at least one conductive portion acting as an antenna in a first state in which the second housing is slid in the first housing and communicate with the external electronic device through the at least one conductive portion acting as an antenna in a second state in which the second housing is slid out the first housing.