公开(公告)号：US11600914B2

公开(公告)日：2023-03-07

申请号：US17102955

申请日：2020-11-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyoseok Na ,  Jooseung Kim ,  Hyunseok Choi

IPC: H01Q1/40 ,  G05F1/46 ,  H03F3/195

Abstract: Various embodiments disclose a method and a device. The device includes: an antenna; a switching regulator; a communication chip including an amplifier, a first linear regulator operably connected to the amplifier and the switching regulator and configured to be supplied with a first voltage from the switching regulator, and a second linear regulator operably connected to the amplifier and the switching regulator and configured to be supplied with a second voltage higher than the first voltage from the switching regulator, the communication chip configured to transmit a radio-frequency signal outside of the electronic device through the antenna; and a control circuit. The control circuit is configured to produce an envelope of an input signal input to the amplifier in connection with the radio-frequency signal and to provide the produced envelope to at least one of the first linear regulator or the second linear regulator. The first linear regulator is configured to provide a third voltage corresponding to the envelope to the amplifier using the first voltage based on the envelope having a voltage in a first range. The second linear regulator is configured to provide a fourth voltage higher than the third voltage to the amplifier using the second voltage based on the voltage of the envelope being in a second range including values larger than values included in the first range.

公开(公告)号：US11456714B2

公开(公告)日：2022-09-27

申请号：US17154264

申请日：2021-01-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyosung Lee ,  Namjun Cho ,  Hyoseok Na ,  Hanyeop Lee

IPC: H03F3/24 ,  H01Q1/24 ,  H01Q21/06 ,  H03F1/56 ,  H04B1/00 ,  H04B1/40

Abstract: Various embodiments relate to an apparatus and a method for processing a radio signal in an electronic device. The electronic device may include: a communication processor; and a power amplifier electrically connected to the communication processor, the power amplifier including a first switch, an input port, a first output port, and a second output port, the power amplifier further including a first amplification circuit disposed on a first electrical path between the input port and the first switch, a second amplification circuit disposed on a second electrical path between the first switch and the first output port, and a third amplification circuit disposed on a third electrical path between the first switch and the second output port.

公开(公告)号：US11445597B2

公开(公告)日：2022-09-13

申请号：US16881399

申请日：2020-05-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonsub Lim ,  Hyoseok Na ,  Wanjae Ju

IPC: H05K1/00 ,  H05K1/02 ,  G06F1/16 ,  H01Q1/24 ,  H01Q1/38 ,  H01R4/04 ,  H01R12/51 ,  H01R12/72 ,  H01R33/02 ,  H05K5/00 ,  H05K1/11 ,  H05K1/14

Abstract: Disclosed is an electronic device that includes a first cover, a second cover opposite the first cover, a side housing disposed between the first cover and the second cover and including a plate disposed between the first cover and the second cover and a frame surrounding the plate and connected with the first cover and the second cover, a display disposed between the plate and the first cover, and a printed circuit board disposed between the plate and the second cover and including a first surface facing the plate, a second surface facing the second cover, and side surfaces provided between the first surface and the second surface, at least some of the side surfaces including plated areas. The plate includes a connection structure to which the printed circuit board is electrically connected, the connection structure includes a recess, the recess including a first sidewall, a second sidewall facing the first sidewall, a first conductive structure comprising a conductive material disposed on the first sidewall, and a second conductive structure comprising a conductive material disposed on the second sidewall, and at least part of the printed circuit board is disposed in the recess such that the plated areas contact the first conductive structure and the second conductive structure.

公开(公告)号：US11323146B2

公开(公告)日：2022-05-03

申请号：US17041858

申请日：2019-03-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyoseok Na

IPC: H04B1/401 ,  H04B17/14 ,  H04B1/04 ,  H04B1/44

Abstract: An electronic device according to various embodiments of the present invention can comprise: a housing; a first antenna element positioned inside the housing or at a first position thereof; a second antenna element positioned inside the housing or at a second position separated from the first position thereof; and a wireless communication circuit positioned inside the housing and electrically coupled to the first antenna element and the second antenna element. The wireless communication circuit comprises: a wireless modem; a source RF circuit electrically connected to the wireless modem, and configured to generate an IF signal; and a second RF circuit positioned at a fourth position closer to the second position than to the first position, wherein: each of the first RF circuit and the second RF circuit is configured to alternately receive an IF signal for transmitting a transmitted signal via the first antenna element and the second antenna element, and includes a first electrical path between the source RF circuit and the second RF circuit, a second electrical path between the source RF circuit and the second RF circuit, and a third electrical path between the first RF circuit and the second RF circuit; the first RF circuit, while being electrically blocked from the first antenna element, is configured to form at least a portion of a first loopback path from the first RF circuit to the source RF circuit through the third electrical path and the second electrical path; and the second RF circuit, while being electrically blocked from the second antenna element, can be configured to form at least a portion of a second loopback path from the second RF circuit to the source RF circuit through the third electrical path and the first electrical path. Additional other embodiments are also possible.

公开(公告)号：US11228413B2

公开(公告)日：2022-01-18

申请号：US16815641

申请日：2020-03-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongjun An ,  Soon Park ,  Kyuhyuck Kwak ,  Janghyun Nam ,  Jonghun Yoo ,  Taeyun Lee ,  Haekwon Lee ,  Hyoseok Na

IPC: H04W24/10 ,  H04L5/00 ,  H04B17/336 ,  H04L1/00

Abstract: An operation method of an electronic device includes determining whether a first communication module based on a first radio access technology (RAT) and a second communication module based on a second RAT operate in a connected state; determining whether a combination of a first band used by the first communication module and a second band used by the second communication module is a combination causing interference; and if the combination of the first band and the second band is a combination causing interference, transmitting a signal requesting to change one of the first band or the second band. The interference is caused by at least one transmission signal of the first RAT or at least one other signal derived from the at least one transmission signal.

公开(公告)号：US20210408669A1

公开(公告)日：2021-12-30

申请号：US17470734

申请日：2021-09-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Namjun Cho ,  Hyoseok Na ,  Yousung Lee

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q21/06 ,  H03F3/195 ,  H03F3/21 ,  H03F3/213 ,  H04B1/04 ,  H04B1/44

Abstract: A portable communication device including a processor positioned in a first PCB, a communication circuit; and an antenna module. The antenna module includes a second PCB, an antenna array positioned in the second PCB, wherein the antenna array includes a plurality of antennas, a plurality of PAs, a plurality of LNAs, wherein the plurality of LNAs is greater than the plurality of PAs, a first transmission-reception circuit positioned in the second PCB, and a first reception circuit positioned in the second PCB.

公开(公告)号：US11003207B2

公开(公告)日：2021-05-11

申请号：US16378924

申请日：2019-04-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungjin Kim ,  Gidae Kim ,  Jungsik Park ,  Hongsik Park ,  Hyoseok Na ,  Jongchul Choi

IPC: G06F1/16 ,  G06F3/041 ,  H04N5/225

Abstract: Disclosed is an electronic device including a flexible display. The electronic device may include a first structure including a first plate, the first plate including a first surface and a second surface facing a direction opposite the first surface, a second structure including a second plate facing the second surface of the first plate and a first side wall extending from the second plate, a flexible touch screen display, and a camera device arranged between the first structure and the second structure.

公开(公告)号：US10931323B2

公开(公告)日：2021-02-23

申请号：US16847869

申请日：2020-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeyun Lee ,  Yongyoun Kim ,  Haeyeon Kim ,  Taekyung Lee ,  Dongil Yang ,  Hyoseok Na ,  Soyoung Lee

IPC: H04B7/04 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q9/06 ,  H04B1/16 ,  H05K5/00 ,  H05K5/02 ,  H05K1/11 ,  H05K1/02 ,  H05K7/14

Abstract: In an embodiment, an electronic device may include a housing including a hinge module, a first housing, and second housing. The first and second housings are rotatably coupled to each other via the hinge module to be in a folded state or an unfolded state. The electronic device may further include a flexible display, at least one conductive pattern disposed in the first housing, at least one conductor disposed at a position in the second housing corresponding to the at least one conductive pattern such that the at least one conductor is capacitively coupled to the conductive pattern when the electronic device is in the folded state, and a wireless communication circuit electrically connected to the at least one conductive pattern in the first housing. Other embodiments are also possible.

公开(公告)号：US20210044026A1

公开(公告)日：2021-02-11

申请号：US16985674

申请日：2020-08-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Namjun Cho ,  Hyoseok Na

IPC: H01Q21/00 ,  H01Q1/38 ,  H01Q21/24 ,  H04B7/0404 ,  H01Q1/24

Abstract: A mobile communication device includes a processor positioned on a first printed circuit board, a radio frequency integrated circuit (RFIC), and an antenna module. The antenna module includes a second printed circuit board, a first antenna and a second antenna positioned on the second printed circuit board, and a plurality of front-end chips positioned on the second printed circuit board. The plurality of front-end chips include a first front-end chip electrically connecting the RFIC and the first antenna, and a second front-end chip electrically connecting the RFIC and the second antenna.

公开(公告)号：US10649599B2

公开(公告)日：2020-05-12

申请号：US16021237

申请日：2018-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seon-Jun Kim ,  Dongil Yang ,  Hyoseok Na

IPC: G06F3/044 ,  H03K17/955 ,  G01V3/08 ,  H03K17/96

Abstract: Various embodiments of the present disclosure relate to an electronic device for using an amplifier to detect whether a user body is close to the electronic device and an operation method thereof. An electronic device according to an embodiment of the present disclosure may include: an antenna configured to be at least a part of an exterior of the electronic device; a variable element that has a capacitance in a designated range; and an amplifier connected to the variable element and configured to amplify a voltage of the variable element by a designated ratio and output an amplified voltage, wherein the capacitance of the variable element and the designated ratio may be configured so that a difference between a voltage of the antenna and the amplified voltage of the amplifier is smaller than a designated threshold value.