公开(公告)号：US20230046098A1

公开(公告)日：2023-02-16

申请号：US17680815

申请日：2022-02-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongyoun KIM ,  Eungkyu KIM ,  Inhyung SONG ,  Hyeonseok LEE

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/34

Abstract: A semiconductor package includes a package substrate, a semiconductor stack on the package substrate, a passive device on the package substrate and spaced apart from the semiconductor stack, and a stiffener on the package substrate and extending around an outer side of the semiconductor stack. The stiffener includes a first step surface extends over the passive device. A width of a bottom surface of the stiffener is smaller than a width of a top surface of the stiffener.