公开(公告)号：US20200161231A1

公开(公告)日：2020-05-21

申请号：US16675877

申请日：2019-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaekul Lee ,  Jinseon Park ,  Junwoo Myung

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/522 ,  H01L23/00

Abstract: A package module includes a core structure including a dummy member, one or more electronic components disposed around the dummy member, and an insulating material covering at least a portion of each of the dummy member and the electronic components, the core structure including a first penetration hole passing through the dummy member and the insulating material, a semiconductor chip disposed in the first penetration hole and having an active surface on which a connection pad is disposed and an inactive surface, an encapsulant covering at least a portion of each of the core structure and the semiconductor chip and filling at least a portion of the first penetration hole, and a connection structure disposed on the core structure and the active surface and including a redistribution layer electrically connected to the electronic components and the connection pad.