公开(公告)号：US20200350476A1

公开(公告)日：2020-11-05

申请号：US16863069

申请日：2020-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjoon LEE ,  Seongho SON ,  Jongsung LEE ,  Youngki JUNG

IPC: H01L33/62 ,  G02B1/14 ,  H01L25/075 ,  G09F9/302 ,  G09G3/32

Abstract: A light emitting diode (LED) module includes an integrated substrate, the integrated substrate including a plurality of LEDs; a glass substrate; and a signal wiring layer provided on the glass substrate. The signal wiring layer includes a plurality of signal electrodes configured to supply a data signal to the plurality of LEDs. The LED module further includes a conductive pattern provided on at least one surface of the integrated substrate, and connected to a ground.