公开(公告)号：US20200219911A1

公开(公告)日：2020-07-09

申请号：US16655762

申请日：2019-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Sung HUR ,  Jin Gyun KIM ,  Kook Tae KIM ,  Young Bin LEE ,  Ha Jin LIM ,  Taek Soo JEON ,  Soo Jin HONG

IPC: H01L27/146

Abstract: An image sensor may include a substrate including first and second surfaces opposite each other, a plurality of photoelectric conversion devices isolated from direct contact with each other within the substrate, a first trench configured to extend into an interior of the substrate from the first surface of the substrate and between adjacent photoelectric conversion devices of the plurality of photoelectric conversion devices, a first supporter within the first trench, and a first isolation layer at least partially covering both sidewalls of the first supporter within the first trench, wherein a lower surface of the first supporter is coplanar with the first surface of the substrate.