公开(公告)号：US20210210414A1

公开(公告)日：2021-07-08

申请号：US17012294

申请日：2020-09-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myungsam KANG ,  Youngchan KO ,  Kyungdon MUN

IPC: H01L23/485 ,  H01L23/00 ,  H01L23/538 ,  H01L21/48

Abstract: A semiconductor package includes a redistribution substrate having a first redistribution layer, a semiconductor chip on the redistribution substrate and connected to the first redistribution layer, a vertical connection conductor on the redistribution substrate and electrically connected to the semiconductor chip through the first redistribution layer, a core member having a first through-hole accommodating the semiconductor chip and a second through-hole accommodating the vertical connection conductor, and an encapsulant covering at least a portion of each of the semiconductor chip, the vertical connection conductor, and the core member, the encapsulant filling the first and second through-holes, wherein the vertical connection conductor has a cross-sectional shape with a side surface tapered to have a width of a lower surface thereof is narrower than a width of an upper surface thereof, and the first and second through-holes have a cross-sectional shape tapered in a direction opposite to the vertical connection conductor.