公开(公告)号：US11979996B2

公开(公告)日：2024-05-07

申请号：US17217759

申请日：2021-03-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

IPC: H05K5/02 ,  H01L25/18 ,  H05K1/18

CPC classification number: H05K5/0217 ,  H05K5/026 ,  H01L25/18 ,  H05K1/181 ,  H05K2201/10159

Abstract: A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.

公开(公告)号：USD996424S1

公开(公告)日：2023-08-22

申请号：US29805543

申请日：2021-08-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing my new design;
FIG. 2 is a front view thereof; and,
FIG. 3 is a top plan view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.

公开(公告)号：USD986901S1

公开(公告)日：2023-05-23

申请号：US29805779

申请日：2021-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof, and,
FIG. 8 is a bottom perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.

公开(公告)号：USD986899S1

公开(公告)日：2023-05-23

申请号：US29805768

申请日：2021-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a bottom perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.

公开(公告)号：USD986898S1

公开(公告)日：2023-05-23

申请号：US29805766

申请日：2021-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a bottom perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.

公开(公告)号：USD986249S1

公开(公告)日：2023-05-16

申请号：US29805777

申请日：2021-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a bottom perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.