公开(公告)号：US20240174550A1

公开(公告)日：2024-05-30

申请号：US18394471

申请日：2023-12-22

Applicant: Schott AG

Inventor： Ulrich Fotheringham ,  Azatuhi Ayrikyan ,  Thomas Pfeiffer ,  Simone Monika Ritter ,  Silke Wolff ,  Tobias Gotschke ,  Christoph Groß ,  Antje Klemm ,  Jens Ulrich Thomas ,  Martin Letz

IPC: C03C3/097 ,  C03C3/089 ,  C03C4/20 ,  C03C15/00 ,  C03C23/00

CPC classification number: C03C3/097 ,  C03C3/089 ,  C03C4/20 ,  C03C15/00 ,  C03C23/006 ,  C03C2204/00

Abstract: A glass composition includes oxides which form non-volatile fluorides at a temperature of 150° C. and a pressure of 5 Pa or less and are present in an amount of less than 0.5 mol % in the glass composition, based on all oxides present in the glass composition. A working point of the glass composition is 1400° C. or less. The glass composition has a hydrolytic resistance characterized by a leachability of GeO2, P2O5 and/or B2O3 from the glass composition determined as concentrations in an eluate prepared according to ISO 719 of at least one of the following: less than 70 mg/l GeO2 in the eluate per 1 mol % GeO2 in the glass composition; less than 70 mg/l P2O5 in the eluate per 1 mol % P2O5 in the glass composition; or less than 300 mg/l B2O3 in the eluate per 1 mol % B2O3 in the glass composition.

公开(公告)号：US20210284569A1

公开(公告)日：2021-09-16

申请号：US17201060

申请日：2021-03-15

Applicant: SCHOTT AG

Inventor： Linda Johanna Bartelt ,  Antonio Trizzino ,  Julia Gold ,  Sabine Pichler-Wilhelm ,  Martin Letz ,  Martun Hovhannisyan

IPC: C03C8/14 ,  C03C8/04 ,  C03C3/093 ,  H01L23/31

Abstract: The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.