公开(公告)号：US06489688B1

公开(公告)日：2002-12-03

申请号：US09847948

申请日：2001-05-02

Applicant: Doug Baumann ,  Louis Pandula

Inventor： Doug Baumann ,  Louis Pandula

IPC: H01L2348

CPC classification number: H01L23/50 ,  H01L23/5286 ,  H01L24/06 ,  H01L2924/14 ,  H01L2924/00

Abstract: Embodiments of the present invention provide flip-chip bond pad arrangements that lead to a smaller increase in die size than conventional approaches. This is accomplished by using the core side of a periphery I/O pad ring for placing some of the bond pads in order to meet the bond pad pitch requirements of flip chip technology. For example, alternating bond pads are moved inward to the core side of the I/O pads or drivers, to meet the bond pad pitch requirement between the bond pads that are moved to the core side as well the bond pads that remain outside of the core. Because the bond pads are moved inward instead of outward, the increase in the die size from the edge of the I/O pad ring is reduced. In an alternative embodiment, the bond pads are each bonded on top of an active circuitry of a corresponding I/O pad. In another alternative embodiment, the bond pads are disposed between I/O pads which are spaced from each other by a spacing in the direction of the periphery of the core to accommodate the bond pads.

Abstract translation: 本发明的实施例提供倒装芯片接合焊盘布置，其导致裸片尺寸比常规方法更小的增加。 这是通过使用周边I / O焊盘环的芯侧来放置一些焊盘来实现的，以便满足倒装芯片技术的焊盘间距要求。 例如，交替接合焊盘向内移动到I / O焊盘或驱动器的芯侧，以满足移动到芯侧的接合焊盘之间的接合焊盘间距要求以及保持在外部的接合焊盘 核心。 由于接合焊盘向内移动而不是向外移动，因此减小了从I / O焊盘环的边缘引起的管芯尺寸的增加。 在替代实施例中，接合焊盘各自接合在对应I / O焊盘的有源电路的顶部上。 在另一替代实施例中，接合焊盘设置在I / O焊盘之间，I / O焊盘在芯的周边方向上间隔开以容纳接合焊盘。

公开(公告)号：US5640415A

公开(公告)日：1997-06-17

申请号：US257968

申请日：1994-06-10

Applicant: Louis Pandula

Inventor： Louis Pandula

IPC: H04B1/713 ,  H04B1/74

CPC classification number: H04B1/74 ,  H04B1/713

Abstract: The technique of redundantly retransmitting digitized voice data on multiple sequential frequencies increases the channel bit rate above the minimum required for normal communication in a frequency-hopping communication system for digitized voice signals. Digitized voice data is redundantly retransmitted on multiple sequential frequencies and the channel bit rate is increased above the minimum required for normal communication. Repeated transmissions of the same block of digitized voice data occurs n times at n times the bit rate of the original digitized voice data. A frequency-hopping transmitter transmits on different channels, or carrier frequencies, which are modulated by the digitized voice data signals from a transmitter data buffer. A receiver data buffer holds n blocks of digitized voice data. A signal quality estimator estimates which of the n blocks of digitized voice data has a desirable signal quality and selects the block of digitized voice data having the desirable signal quality at an output terminal of the system.

公开(公告)号：US5299236A

公开(公告)日：1994-03-29

申请号：US974747

申请日：1992-11-13

Applicant: Louis Pandula

Inventor： Louis Pandula

IPC: H04L7/04 ,  H04L7/00 ,  H03D1/00 ,  H04J3/06 ,  H04L27/06

CPC classification number: H04L7/043

Abstract: A system and method for obtaining and maintaining synchronization with an incoming signal prior to and during the transmission of data. Specifically, embodiments of the present invention contemplate that synchronization is obtained by searching for an initial portion of a pattern in an input signal. Once the pattern is detected, the pattern (and/or some mathematical derivation thereof) must subsequently be detected a pre-determined number of times. Once synchronization has been obtained, a pattern is continually looked for in the input signal in order to maintain synchronization. The present invention maintains this synchronization even though data may be embedded within this input signal.

Abstract translation: 一种用于在传输数据之前和期间获取并保持与输入信号同步的系统和方法。 具体地，本发明的实施例考虑通过在输入信号中搜索模式的初始部分来获得同步。 一旦检测到图案，则随后可以以预定次数检测图案（和/或其某些数学推导）。 一旦获得了同步，就继续在输入信号中寻找模式，以保持同步。 即使数据可以嵌入在该输入信号内，本发明保持该同步。