公开(公告)号：US20180286566A1

公开(公告)日：2018-10-04

申请号：US15940170

申请日：2018-03-29

Applicant: TDK CORPORATION

Inventor： Shunji AOKI ,  Yuya ISHIMA ,  Makoto TAKAHASHI ,  Shougo OKAMOTO ,  Takafumi TAKAHASHI ,  Hajime KATO ,  Yuto SHIGA

IPC: H01F27/28 ,  H01F41/04 ,  H01F27/29

Abstract: An electronic component includes an element body, a conductor, and a plated electrode layer. The element body includes a first outer surface provided with a first recess. The conductor includes a first conductor portion. The first conductor portion is disposed in the first recess and includes a first face opposed to a bottom face of the first recess and a second face opposed to the first face. The plated electrode layer includes a first plating portion covering the second face. The second face includes a first slope inclined with respect to the first outer surface in such a way as to be recessed toward the bottom face side of the first recess from the first outer surface.