公开(公告)号：US20210358682A1

公开(公告)日：2021-11-18

申请号：US17320380

申请日：2021-05-14

Applicant: TDK CORPORATION

Inventor： Kyosuke Inui ,  Toru Tonogai ,  Yuichi Oyanagi

IPC: H01F27/29

Abstract: An electronic component according to the present invention includes: an element body containing metal particles and a resin; and a resin electrode layer formed on an electrode facing portion which is a part of an outer surface of the element body. The resin electrode layer contains a resin component and a conductor powder. In addition, the electrode facing portion includes an exposed portion formed by removing the resin on an outermost surface of the element body to expose a part of an outer periphery of the metal particles located on the outermost surface. Then, the resin electrode layer and the exposed portion of the electrode facing portion are joined to each other.