公开(公告)号：US20240395769A1

公开(公告)日：2024-11-28

申请号：US18783555

申请日：2024-07-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Kuo Lung Pan ,  Shu-Rong Chun ,  Chi-Hui Lai ,  Tin-Hao Kuo ,  Hao-Yi Tsai ,  Chung-Shi Liu

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L23/64 ,  H01L25/00 ,  H01L25/065

Abstract: A package includes a package substrate, an interposer over and bonded to the package substrate, a first wafer over and bonding to the interposer, and a second wafer over and bonding to the first wafer. The first wafer has independent passive device dies therein. The second wafer has active device dies therein.

公开(公告)号：US11004827B2

公开(公告)日：2021-05-11

申请号：US16133702

申请日：2018-09-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei Kang Hsieh ,  Hung-Yi Kuo ,  Hao-Yi Tsai ,  Kuo Lung Pan ,  Tin-Hao Kuo ,  Yu-Chia Lai ,  Mao-Yen Chang ,  Po-Yuan Teng ,  Shu-Rong Chun

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

Abstract: A manufacturing method of a semiconductor package includes the following steps. At least one lower semiconductor device is provided. A plurality of conductive pillars are formed on the at least one lower semiconductor device. A dummy die is disposed on a side of the at least one lower semiconductor device. An upper semiconductor device is disposed on the at least one lower semiconductor device and the dummy die, wherein the upper semiconductor device reveals a portion of the at least one lower semiconductor device where the plurality of conductive pillars are disposed. The at least one lower semiconductor device, the dummy die, the upper semiconductor device, and the plurality of conductive pillars are encapsulated in an encapsulating material. A redistribution structure is formed over the upper semiconductor device and the plurality of conductive pillars.