公开(公告)号：US20180304521A1

公开(公告)日：2018-10-25

申请号：US15950725

申请日：2018-04-11

申请人： Toshiba Kikai Kabushiki Kaisha

发明人： Mitsunori Kokubo ,  Yuki Sugiura ,  Shigeru Fujiwara ,  Yuki Hashimoto

IPC分类号： B29C59/00 ,  B29C59/04 ,  B29C35/08

CPC分类号： B29C59/002 ,  B29C35/0805 ,  B29C59/046 ,  B29C2035/0827

摘要： A transfer apparatus of an embodiment includes a substrate installation part on which a substrate provided with an uncured material is installed, a mold presser roller for pressing the mold against the substrate by a movement of the mold presser roller to the substrate installed on the substrate installation part, and a material recovery unit capable of recovering the uncured material protruding from between the substrate and the mold by the movement of the mold pressure.