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11.发明申请SYSTEM TO IMPROVE OPERATION OF A DATA CENTER WITH HETEROGENEOUS COMPUTING CLOUDS 有权改进具有异质计算云的数据中心的操作的系统公开(公告)号：US20120254400A1
公开(公告)日：2012-10-04
申请号：US13077578
申请日：2011-03-31
IPC分类号： G06F15/173
CPC分类号： G06F9/5094 , Y02D10/22
摘要： A system to improve operation of a data center with heterogeneous computing clouds may include monitoring components to track data center climate controls and individual heterogeneous computing clouds' operating parameters within the data center. The system may also include a controller that regulates the individual heterogeneous computing clouds and data center climate controls based upon data generated by the monitoring components to improve the operating performance of the individual heterogeneous computing clouds as well as the operating performance of the data center. The system may further include spilling computing clouds to receive excess workload of an individual heterogeneous computing cloud without violating individual heterogeneous computing clouds contracts.
摘要翻译： 改进具有异构计算云的数据中心运行的系统可能包括监视组件以跟踪数据中心气候控制和数据中心内的个别异构计算云运行参数。 该系统还可以包括控制器，其基于由监视组件生成的数据来调节各个异构计算云和数据中心气候控制，以改善各个异构计算云的操作性能以及数据中心的操作性能。 该系统可以进一步包括溢出计算云以接收单个异构计算云的额外的工作量，而不违反个别的异构计算云合同。
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公开(公告)号：US07826215B2
公开(公告)日：2010-11-02
申请号：US12032230
申请日：2008-02-15
CPC分类号： H05K7/20836 , H05K7/20727
摘要： A temperature isolation duct in a computer system comprising a chassis securing a circuit board and a fan system that draws air through the chassis, and a heat-generating component is mounted on the circuit board and exposed to the air flow. The hot air duct passively directs air heated by the heat-generating component from a single hot air duct inlet in direct downstream alignment with the heat-generating component to a single hot air duct outlet. A thermal sensor is secured within, or in direct alignment with, the hot air duct near the duct outlet for sensing the temperature of air flowing through the hot air duct and generating a temperature signal. A controller is in electronic communication with the thermal sensor for receiving the temperature signal and in electronic communication with the fan system for sending a fan speed control signal.
摘要翻译： 计算机系统中的温度隔离管道，包括固定电路板的底盘和通过底盘吸入空气的风扇系统，以及发电部件安装在电路板上并暴露于空气流中。 热风管道将发热部件加热的空气从发热部件直接下游对准，将单个热风管道入口导向单个热风管道出口。 热传感器固定在管道出口附近的热空气管道内或与其直接对准，以便感测流过热风管道的空气的温度并产生温度信号。 控制器与热传感器进行电子通信，用于接收温度信号，并与风扇系统进行电子通信，以发送风扇速度控制信号。
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公开(公告)号：US07660116B2
公开(公告)日：2010-02-09
申请号：US12107010
申请日：2008-04-21
申请人： Alan Claassen , Eric Alan Eckberg , Dennis John Hansen , Vinod Kamath , Madhusudan K. Iyengar , Howard Victor Mahaney, Jr. , Michael Sven Miller , Stephen Peter Mroz
发明人： Alan Claassen , Eric Alan Eckberg , Dennis John Hansen , Vinod Kamath , Madhusudan K. Iyengar , Howard Victor Mahaney, Jr. , Michael Sven Miller , Stephen Peter Mroz
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/20736 , H05K7/2079 , Y10T29/49826
摘要： Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices.
摘要翻译： 用于冷却一个或多个基于机架的计算机系统的机架组件和方法，以及利用机架组件的数据中心配置。 机架组件包括一个支架，用于支撑多列发热电子设备和设备风扇，用于将空气从机架的空气入口侧移动穿过设备并通过机架的空气出口侧。 机架组件还包括一个整体门，其具有横跨机架的空气出口侧的支撑框架，并将门铰接地连接到机架的后垂直边缘。 门包括空气到液体的热交换器面板，其横跨支撑框架内的空气出口通道，使得通过出气口的空气基本上必须通过热交换器面板。 空气出口通道的横截面积基本上等于或大于多列发热装置的横截面面积。
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公开(公告)号：US20090262501A1
公开(公告)日：2009-10-22
申请号：US12107010
申请日：2008-04-21
申请人： Alan Claassen , Eric Alan Eckberg , Dennis John Hansen , Vinod Kamath , Madhusudan K. Iyengar , Howard Victor Mahaney, JR. , Michael Sven Miller , Stephen Peter Mroz
发明人： Alan Claassen , Eric Alan Eckberg , Dennis John Hansen , Vinod Kamath , Madhusudan K. Iyengar , Howard Victor Mahaney, JR. , Michael Sven Miller , Stephen Peter Mroz
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/20736 , H05K7/2079 , Y10T29/49826
摘要： Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices.
摘要翻译： 用于冷却一个或多个基于机架的计算机系统的机架组件和方法，以及利用机架组件的数据中心配置。 机架组件包括一个支架，用于支撑多列发热电子设备和设备风扇，用于将空气从机架的空气入口侧移动穿过设备并通过机架的空气出口侧。 机架组件还包括一个整体门，其具有横跨机架的空气出口侧的支撑框架，并将门铰接地连接到机架的后垂直边缘。 门包括空气到液体的热交换器面板，其横跨支撑框架内的空气出口通道，使得通过出气口的空气基本上必须通过热交换器面板。 空气出口通道的横截面积基本上等于或大于多列发热装置的横截面面积。
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15.发明申请公开(公告)号：US20090256512A1
公开(公告)日：2009-10-15
申请号：US12099841
申请日：2008-04-09
申请人： Ralph Murray Begun , Raymond Mathew Clemo , Karl Klaus Dittus , Vinod Kamath , Michael Sven Miller , Warren Everett Price , Whitcomb Randolph Scott, III
发明人： Ralph Murray Begun , Raymond Mathew Clemo , Karl Klaus Dittus , Vinod Kamath , Michael Sven Miller , Warren Everett Price , Whitcomb Randolph Scott, III
CPC分类号： G06F1/20 , H05K7/20209 , Y10S388/934
摘要： A system comprising a chassis that includes a plurality of modules and a fan assembly disposed in a distal end of the chassis for drawing air in parallel pathways through the plurality of modules. At least one of the modules is a compute module having a thermal sensor disposed to sense the temperature of air flowing across a processor mounted on a motherboard. The system further comprises a fan controller receiving output from the thermal sensor, wherein the fan controller operates the fan assembly to cool the plurality of modules and maintain the thermal sensor output within an operating temperature range. The fan controller controls the fan speed according to predetermined thermal profile settings associated with one of the compute modules received in the chassis. For example, the predetermined thermal profile settings may include a minimum fan speed, a maximum fan speed, and control loop feedback settings.
摘要翻译： 一种包括底盘的系统，其包括多个模块和设置在所述底盘的远端中的风扇组件，用于通过所述多个模块的并行路径抽取空气。 至少一个模块是具有热传感器的计算模块，该热传感器设置成感测流过安装在母板上的处理器的空气的温度。 该系统还包括接收来自热传感器的输出的风扇控制器，其中风扇控制器操作风扇组件以冷却多个模块并将热传感器输出保持在工作温度范围内。 风扇控制器根据与在机箱中接收的计算模块之一相关联的预定热分布设置来控制风扇速度。 例如，预定的热分布设置可以包括最小风扇速度，最大风扇速度和控制回路反馈设置。
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公开(公告)号：US20080116571A1
公开(公告)日：2008-05-22
申请号：US11604152
申请日：2006-11-22
申请人： Hien P. Dang , Vinod Kamath , Vijayeshwar D. Khanna , Gerard McVicker , Sri M. Sri-Jayantha , Jung H. Yoon
发明人： Hien P. Dang , Vinod Kamath , Vijayeshwar D. Khanna , Gerard McVicker , Sri M. Sri-Jayantha , Jung H. Yoon
IPC分类号： H01L23/467
CPC分类号： H01L23/4093 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom area of the structure.
摘要翻译： 用于直列芯片模块的弹簧状冷却结构由具有前侧和后侧的导热材料的连续片材形成，所述片材以基本上以一百八十度的角度折叠，其中长度 的结构基本上与直列芯片模块的长度相关，并且该结构的宽度比直列芯片模块的宽度宽，使得该结构适合于并且基本上围绕在线芯片模块; 在结构的左侧，右侧和底部的开口，用于容易地从线内芯片模块固定和移除结构; 顶部，其包括顶部表面，所述顶部表面设置在所述直列芯片模块的顶部上，当固定到所述在线芯片模块时，并且包括从所述直列芯片模块向外扩张的成角度的表面， 顶面 中心水平部分; 中心水平部分和多个芯片之间的间隙; 和结构的扩口底部区域。
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公开(公告)号：US20080055855A1
公开(公告)日：2008-03-06
申请号：US11470530
申请日：2006-09-06
申请人： Vinod Kamath , Jason Aaron Matteson
发明人： Vinod Kamath , Jason Aaron Matteson
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Heat sinks and methods are provided for improved cooling of heat-generating components. In one embodiment, a heat sink includes a base having a first wall, a second wall, and a plurality of heat pipes sandwiched therebetween. The first and second walls, optionally plates, are spaced apart to provide an airflow pathway through the base. An outer cooling fin structure is disposed on the second wall, and an optional inner cooling fin structure may be disposed on the first wall. A plurality of perforations and/or a plurality of grooves may also be formed on the walls. The heat sink is secured to a chassis with the first wall in thermal contact with a CPU. Air flows through the cooling fin structure(s), as well as through the base, grooves, and holes. The airflow through the base, grooves, and holes improves cooling and lowers the impedance of the heat sink.
摘要翻译： 提供散热器和方法来改善发热部件的冷却。 在一个实施例中，散热器包括具有第一壁，第二壁和夹在其间的多个热管的基座。 第一和第二壁（可选的板）间隔开以提供穿过基座的气流路径。 外部冷却翅片结构设置在第二壁上，并且可选的内部冷却翅片结构可设置在第一壁上。 也可以在壁上形成多个穿孔和/或多个凹槽。 散热器固定在底盘上，第一个墙壁与CPU热接触。 空气流过冷却翅片结构，以及通过基座，凹槽和孔。 通过基座，槽和孔的气流改善了散热，降低了散热器的阻抗。
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公开(公告)号：US20080046766A1
公开(公告)日：2008-02-21
申请号：US11506876
申请日：2006-08-21
申请人： Trieu C. Chieu , Hoi Y. Chan , Vinod Kamath , Lawrence S. Mok
发明人： Trieu C. Chieu , Hoi Y. Chan , Vinod Kamath , Lawrence S. Mok
IPC分类号： G06F1/00
CPC分类号： G06F1/206 , H05K7/20836
摘要： A method, system and computer readable medium for maximizing the performance of a computer system that includes at least one computing unit. Temperature and location data for each computing unit is received by a server unit and the location of each computing unit within a given environment is reevaluated and revised to maximize the overall performance of the computer system.
摘要翻译： 一种用于使包括至少一个计算单元的计算机系统的性能最大化的方法，系统和计算机可读介质。 每个计算单元的温度和位置数据由服务器单元接收，并且重新评估和修改给定环境内的每个计算单元的位置以使计算机系统的整体性能最大化。
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公开(公告)号：US09179574B2
公开(公告)日：2015-11-03
申请号：US13114203
申请日：2011-05-24
CPC分类号： H05K7/1497 , F25B25/005 , F25B2700/2106 , F25B2700/21173 , F25D11/003 , F25D17/02 , H05K7/2079 , Y10T29/49359
摘要： A cooling unit and cooling method are provided for a container-type data center. The cooling unit includes a heat rejection unit, for rejecting heat from coolant passing through a coolant loop to air passing across the heat rejection unit, and a refrigeration unit controllable to selectively provide auxiliary cooling to at least a portion of the coolant passing through the coolant loop. The heat rejection unit includes a heat exchange assembly, having a first heat exchanger and a second heat exchanger, and one or more air-moving devices providing airflow across the first and second heat exchangers. The first heat exchanger couples in fluid communication with the coolant loop, and the second heat exchanger is coupled in fluid communication with a refrigeration loop of the refrigeration unit for rejecting heat from refrigerant passing through the refrigeration loop to the airflow passing across the second heat exchanger.
摘要翻译： 为集装箱式数据中心提供冷却装置和冷却方法。 冷却单元包括排热单元，用于将来自通过冷却剂回路的冷却剂的热量排除通过散热单元的空气;以及制冷单元，其可控制以选择性地向通过冷却剂的冷却剂的至少一部分提供辅助冷却 循环。 散热单元包括具有第一热交换器和第二热交换器的热交换组件，以及提供横跨第一和第二热交换器的气流的一个或多个气动装置。 所述第一热交换器与所述冷却剂回路流体连通，并且所述第二热交换器与所述制冷单元的制冷回路流体连通地联接，用于将通过所述制冷回路的制冷剂的热量排出到穿过所述第二热交换器的气流 。
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20.发明授权公开(公告)号：US08755948B2
公开(公告)日：2014-06-17
申请号：US12945958
申请日：2010-11-15
CPC分类号： G05D23/1934 , H05K7/20772 , H05K7/20836
摘要： Methods and systems for controlling fluid coolant flow in cooling systems of computing devices are disclosed. According to an aspect, a method may include determining a temperature of a fluid coolant in a cooling system of a computing device. For example, a temperature of water exiting a cooling system of a server may be determined. The method may also include determining an operational condition of the computing device. For example, a temperature of a processor, memory, or input/output (I/O) component may be determined. Further, the method may include controlling a flow of the fluid coolant through the cooling system based on the temperature of the fluid coolant and/or the operational condition.
摘要翻译： 公开了用于控制计算设备的冷却系统中的流体冷却剂流的方法和系统。 根据一个方面，一种方法可以包括确定计算装置的冷却系统中的流体冷却剂的温度。 例如，可以确定离开服务器的冷却系统的水的温度。 该方法还可以包括确定计算设备的操作条件。 例如，可以确定处理器，存储器或输入/输出（I / O）组件的温度。 此外，该方法可以包括基于流体冷却剂的温度和/或操作条件来控制通过冷却系统的流体冷却剂的流动。
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