PIPING DESIGN FOR HIGH DENSITY PLASMA PROCESS CHAMBER
    11.
    发明申请
    PIPING DESIGN FOR HIGH DENSITY PLASMA PROCESS CHAMBER 审中-公开
    高密度等离子体处理室的管道设计

    公开(公告)号:US20080023084A1

    公开(公告)日:2008-01-31

    申请号:US11692567

    申请日:2007-03-28

    CPC classification number: F17D1/086 Y10T137/87185

    Abstract: The present invention discloses a piping design for a high density plasma process chamber, wherein an extra pipe is added to between a process chamber and a mass flow controller, and the extra pipe together with a pump is used to drain out the gas, which cannot be monitored by the mass flow controller and survives in a gas injection pipe, lest the remaining gas pollute the deposited film or react with the process gas to induce an explosion in the succeeding deposition process.

    Abstract translation: 本发明公开了一种用于高密度等离子体处理室的管道设计,其中在处理室和质量流量控制器之间添加额外的管道,并且使用额外的管道与泵一起排出不能 由质量流量控制器监控并在气体注入管道中存活,以免残留的气体污染沉积的膜或与处理气体反应,以在随后的沉积过程中引起爆炸。

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