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公开(公告)号：US07137879B2
公开(公告)日：2006-11-21
申请号：US11393220
申请日：2006-03-30
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
CPC分类号： B82Y30/00 , B24B37/046 , B24B37/24 , B24B37/26 , B24D3/34
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.
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公开(公告)号：US07207878B2
公开(公告)日：2007-04-24
申请号：US11031545
申请日：2005-01-08
申请人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
发明人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
IPC分类号： B24D11/00
CPC分类号： B82Y30/00 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/14 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , H01L21/32125 , Y10T428/249924
摘要： Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.
摘要翻译： 提供了用于处理基板的抛光制品的实施例。 在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。 导电层具有适于抛光衬底的暴露表面。 织物层可以是编织的或非织造的。 导电层可以由软金属构成，并且在一个实施例中，暴露的表面可以是平面的。
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公开(公告)号：US06991528B2
公开(公告)日：2006-01-31
申请号：US10455941
申请日：2003-06-06
申请人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
发明人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
CPC分类号： B82Y30/00 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/14 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , H01L21/32125 , Y10T428/249924
摘要： Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.
摘要翻译： 提供了用于处理基板的抛光制品的实施例。 在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。 导电层具有适于抛光衬底的暴露表面。 织物层可以是编织的或非织造的。 导电层可以由软金属构成，并且在一个实施例中，暴露的表面可以是平面的。
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公开(公告)号：US07160432B2
公开(公告)日：2007-01-09
申请号：US10608404
申请日：2003-06-26
申请人： Feng Q. Liu , Liang-Yuh Chen , Stan D. Tsai , Alain Duboust , Siew S. Neo , Yongqi Hu , Yan Wang , Paul D. Butterfield
发明人： Feng Q. Liu , Liang-Yuh Chen , Stan D. Tsai , Alain Duboust , Siew S. Neo , Yongqi Hu , Yan Wang , Paul D. Butterfield
IPC分类号： B23H5/08
CPC分类号： B23H3/08 , B23H5/08 , B24B37/0056 , B24B37/044 , B24B37/046 , C09G1/04 , C25F3/02 , H01L21/3212 , H01L21/32125 , H01L21/32134 , H01L21/7684
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique. The electrochemical mechanical polishing technique may include a polishing composition comprising an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, and a solvent.
摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 在一个方面，提供了一种处理衬底以除去布置在形成于衬底中的窄特征定义之上的导电材料的方法，该导电材料以比通过电化学机械抛光技术在衬底中形成的宽特征定义上布置的导电材料更高的去除速率。 电化学机械抛光技术可以包括抛光组合物，其包含酸性电解质体系，一种或多种螯合剂，一种或多种腐蚀抑制剂，一种或多种无机或有机酸盐，一种或多种pH调节剂，以提供约 2和约10，和溶剂。
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公开(公告)号：US20080156657A1
公开(公告)日：2008-07-03
申请号：US12014687
申请日：2008-01-15
申请人： Paul D. Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler
发明人： Paul D. Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler
IPC分类号： B23H3/00
CPC分类号： B23H5/08 , B23H5/10 , B24B37/046 , B24B37/24 , B24B53/017 , B24D13/14 , H01L21/32125
摘要： Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.
摘要翻译： 提供球组件的实施例。 在一个实施例中，球组件包括壳体，球，导电适配器和接触元件。 壳体具有延伸到内部通道的第一端的环形座。 导电适配器联接到壳体的第二端。 接触元件将适配器和球电耦合并保持在座椅和适配器之间的壳体中。
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公开(公告)号：US07374644B2
公开(公告)日：2008-05-20
申请号：US10608513
申请日：2003-06-26
申请人： Paul D. Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler
发明人： Paul D. Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler
IPC分类号： C25D17/00
CPC分类号： H01L21/32125 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017
摘要： Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.
摘要翻译： 提供球组件的实施例。 在一个实施例中，球组件包括壳体，球，导电适配器和接触元件。 壳体具有延伸到内部通道的第一端的环形座。 导电适配器联接到壳体的第二端。 接触元件将适配器和球电耦合并保持在座椅和适配器之间的壳体中。
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公开(公告)号：US07077721B2
公开(公告)日：2006-07-18
申请号：US10727724
申请日：2003-12-03
申请人： Yongqi Hu , Stan D. Tsai , Yan Wang , Feng Q. Liu , Shou-Sung Chang , Liang-Yuh Chen
发明人： Yongqi Hu , Stan D. Tsai , Yan Wang , Feng Q. Liu , Shou-Sung Chang , Liang-Yuh Chen
CPC分类号： B24B37/26 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/042 , B24B37/046 , B24B37/22 , B24B37/24 , B24B49/16 , B24B53/017 , C25D17/14 , H01L21/32125
摘要： Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.
摘要翻译： 提供了用于处理衬底的处理衬垫组件的实施例。 处理垫组件包括具有处理表面的上层和具有联接到上层的顶侧和与顶侧相对的底侧的电极。 通过上层形成第一组孔，用于将电极暴露于处理表面。 通过上层和电极形成至少一个孔。
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公开(公告)号：US07344431B2
公开(公告)日：2008-03-18
申请号：US11458356
申请日：2006-07-18
申请人： Yongqi Hu , Stan D. Tsai , Yan Wang , Feng Q. Liu , Shou-Sung Chang , Liang-Yuh Chen
发明人： Yongqi Hu , Stan D. Tsai , Yan Wang , Feng Q. Liu , Shou-Sung Chang , Liang-Yuh Chen
CPC分类号： B24B37/26 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/042 , B24B37/046 , B24B37/22 , B24B37/24 , B24B49/16 , B24B53/017 , C25D17/14 , H01L21/32125
摘要： Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.
摘要翻译： 提供了用于处理衬底的处理衬垫组件的实施例。 处理垫组件包括具有处理表面的上层和具有联接到上层的顶侧和与顶侧相对的底侧的电极。 通过上层形成第一组孔，用于将电极暴露于处理表面。 通过上层和电极形成至少一个孔。
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公开(公告)号：US07232514B2
公开(公告)日：2007-06-19
申请号：US10456220
申请日：2003-06-06
申请人： Feng Q. Liu , Stan D. Tsai , Yongqi Hu , Siew S. Neo , Yan Wang , Alain Duboust , Liang-Yuh Chen
发明人： Feng Q. Liu , Stan D. Tsai , Yongqi Hu , Siew S. Neo , Yan Wang , Alain Duboust , Liang-Yuh Chen
IPC分类号： C25F3/00
CPC分类号： H01L21/32125 , B23H3/08 , B23H5/08 , B24B37/0056 , B24B37/044 , B24B37/046 , C09G1/02 , C09G1/04 , C25F3/02 , H01L21/32134
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.
摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 一方面，组合物包括酸性电解质体系，一种或多种螯合剂，一种或多种腐蚀抑制剂，一种或多种无机或有机酸盐，一种或多种pH调节剂，以提供约2至约10 ，选自磨料颗粒，一种或多种氧化剂及其组合的研磨增强材料和溶剂。 该组合物可用于导电材料去除工艺中，包括在包括电极的处理设备中设置其上形成有导电材料层的衬底，在电极和衬底之间提供组合物，在电极和衬底之间施加偏压，以及 从导电材料层去除导电材料。
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公开(公告)号：US07323416B2
公开(公告)日：2008-01-29
申请号：US11196876
申请日：2005-08-04
申请人： Feng Q. Liu , Tianbao Du , Alain Duboust , Yan Wang , Yongqi Hu , Stan D. Tsai , Liang-Yuh Chen , Wen-Chiang Tu , Wei-Yung Hsu
发明人： Feng Q. Liu , Tianbao Du , Alain Duboust , Yan Wang , Yongqi Hu , Stan D. Tsai , Liang-Yuh Chen , Wen-Chiang Tu , Wei-Yung Hsu
IPC分类号： H01L21/302
CPC分类号： B23H5/08 , B24B37/042 , C25F3/02 , H01L21/32125 , H01L21/6875 , H01L21/7684
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique, and then polishing the substrate by at least a chemical mechanical polishing technique.
摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 在一个方面，提供了一种处理衬底以除去布置在形成于衬底中的窄特征定义上的导电材料的方法，该导电材料以比通过电化学机械抛光技术在衬底中形成的宽特征定义上布置的导电材料更高的去除速率除去，以及 然后用至少一种化学机械抛光技术研磨衬底。
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