公开(公告)号：US20110216515A1

公开(公告)日：2011-09-08

申请号：US12852063

申请日：2010-08-06

Applicant: Jin-Won LEE ,  Yul-Kyo Chung ,  Doo-Hwan Lee ,  Seung-Hyun Sohn ,  Dae-Jung Byun

Inventor： Jin-Won LEE ,  Yul-Kyo Chung ,  Doo-Hwan Lee ,  Seung-Hyun Sohn ,  Dae-Jung Byun

IPC: H05K1/18 ,  B32B38/10 ,  B32B38/04

CPC classification number: B32B38/04 ,  B32B38/10 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/351 ,  H05K1/18 ,  H01L2924/00

Abstract: An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, an electro device embedded printed circuit board is manufactured by: adhering a first electro device on a supporting body through a face-down method; adhering a second electro device on an upper surface of the first electro device through a face-up method; stacking a pure resin layer and a reinforcing layer on an upper side of the supporting body, wherein the first electro device and the second electro device are embedded in the pure resin layer; removing the supporting body; stacking an insulation layer on a lower side of the first electro device, a reinforcing material having been impregnated in the insulation layer; and patterning a circuit on each of the reinforcing layer and the insulation layer.

Abstract translation: 公开了电子装置嵌入式印刷电路板及其制造方法。 根据本发明的实施例，通过以下方式制造电子装置嵌入式印刷电路板：通过面朝下方法将第一电子装置粘附在支撑体上; 通过面朝上方法将第二电子装置粘附在第一电子装置的上表面上; 在支撑体的上侧堆叠纯树脂层和增强层，其中第一电装置和第二电装置嵌入在纯树脂层中; 去除支撑体; 在第一电子装置的下侧堆叠绝缘层，浸渍在绝缘层中的增强材料; 并且在每个加强层和绝缘层上构图电路。