公开(公告)号：US07847296B2

公开(公告)日：2010-12-07

申请号：US12066366

申请日：2006-04-24

申请人： Hiroshi Sugimoto ,  Yoshinori Matsuno ,  Kenichi Ohtsuka ,  Noboru Mikami ,  Kenichi Kuroda

发明人： Hiroshi Sugimoto ,  Yoshinori Matsuno ,  Kenichi Ohtsuka ,  Noboru Mikami ,  Kenichi Kuroda

IPC分类号： H01L29/15

CPC分类号： H01L29/8611 ,  H01L21/0445 ,  H01L29/045 ,  H01L29/0684 ,  H01L29/1608 ,  H01L29/6606

摘要： On a major surface of an n-type silicon carbide inclined substrate (2) is formed an n-type voltage-blocking layer (3) made of silicon carbide by means of epitaxial growth. On the n-type voltage-blocking layer (3) is formed a p-type silicon carbide region (4) rectangular when viewed from above. On the surface of the p-type silicon carbide region (4) is formed a p-type contact electrode (5). In the p-type silicon carbide region (4), the periphery of the p-type silicon carbide region (4) that is parallel with a (11-20) plane (14a) of the silicon carbide crystal, which is liable to cause avalanche breakdown, is located on the short side. In this manner, the dielectric strength of a silicon carbide semiconductor device can be improved.

摘要翻译： 在n型碳化硅倾斜衬底（2）的主表面上通过外延生长形成由碳化硅制成的n型压阻层（3）。 在从上方观察时，在n型电压阻挡层（3）上形成矩形的p型碳化硅区域（4）。 在p型碳化硅区域（4）的表面上形成p型接触电极（5）。 在p型碳化硅区域（4）中，与碳化硅晶体的（11-20）面（14a）平行的p型碳化硅区域（4）的周边易于引起 雪崩破裂，位于短边。 以这种方式，可以提高碳化硅半导体器件的介电强度。

公开(公告)号：US20060118812A1

公开(公告)日：2006-06-08

申请号：US11142322

申请日：2005-06-02

申请人： Kenichi Ohtsuka ,  Yoichiro Tarui ,  Yoshinori Matsuno ,  Kenichi Kuroda ,  Hiroshi Sugimoto

发明人： Kenichi Ohtsuka ,  Yoichiro Tarui ,  Yoshinori Matsuno ,  Kenichi Kuroda ,  Hiroshi Sugimoto

IPC分类号： H01L29/74

CPC分类号： H01L29/0619 ,  H01L29/1608 ,  H01L29/872 ,  Y10S388/917

摘要： A semiconductor device includes an anode electrode in Schottky contact with an n-type drift layer formed in an SiC substrate and a JTE region formed outside the anode electrode. The JTE region is made up of a first p-type zone formed in an upper portion of the drift layer under an edge of the anode electrode and a second p-type zone formed outside the first p-type zone having a lower surface impurity concentration than the first p-type zone. The second p-type zone is provided 15 μm or more outwardly away from the edge of the anode electrode. The surface impurity concentration of the first p-type zone ranges from 1.8×1013 to 4×1013 cm−2, and that of the second p-type zone ranges from 1×1013 to 2.5×1013 cm−2.

摘要翻译： 半导体器件包括与形成在SiC衬底中的n型漂移层肖特基接触的阳极电极和形成在阳极电极外部的JTE区域。 JTE区域由在阳极电极的边缘的漂移层的上部形成的第一p型区域和形成在具有较低表面杂质浓度的第一p型区域外的第二p型区域构成 比第一个p型区域。 第二个p型区域距离阳极电极的边缘向外提供15个或更多个外部。 第一p型区域的表面杂质浓度范围为1.8×10 13〜4×10 -3 cm -2，而第二p型区域的表面杂质浓度为 型区域范围为1×10 13至2.5×10 13 cm -2。

公开(公告)号：US08119495B2

公开(公告)日：2012-02-21

申请号：US13096246

申请日：2011-04-28

申请人： Kenichi Kuroda ,  Kozo Watanabe ,  Hirohiko Yamamoto

发明人： Kenichi Kuroda ,  Kozo Watanabe ,  Hirohiko Yamamoto

IPC分类号： H01L21/76

CPC分类号： H01L23/5283 ,  H01L21/31053 ,  H01L21/74 ,  H01L21/76224 ,  H01L21/76229 ,  H01L23/522 ,  H01L23/528 ,  H01L23/53228 ,  H01L27/0207 ,  H01L27/11807 ,  H01L29/0649 ,  H01L29/0653 ,  H01L29/0692 ,  H01L29/4925 ,  H01L2924/0002 ,  H01L2924/00

摘要： There is provided a technique for improving the flatness at the surface of members embedded in a plurality of recesses without resulting in an increase in the time required for the manufacturing processes. According to this technique, the dummy patterns can be placed up to the area near the boundary BL between the element forming region DA and dummy region FA by placing the first dummy pattern DP1 of relatively wider area and the second dummy pattern DP2 of relatively small area in the dummy region FA. Thereby, the flatness of the surface of the silicon oxide film embedded within the isolation groove can be improved over the entire part of the dummy region FA. Moreover, an increase of the mask data can be controlled when the first dummy patterns DP1 occupy a relatively wide region among the dummy region FA.

摘要翻译： 提供了一种用于改善嵌入在多个凹部中的构件的表面处的平坦度而不导致制造过程所需时间增加的技术。 根据该技术，通过将相对较宽区域的第一伪图案DP1和相对较小面积的第二虚设图案DP2放置在元件形成区域DA和虚拟区域FA之间的边界BL附近的虚拟图案， 在虚拟区域FA中。 由此，可以在虚拟区域FA的整个部分改善嵌入在隔离槽内的氧化硅膜的表面的平坦度。 此外，当第一伪图案DP1占据虚拟区域FA中相对较宽的区域时，可以控制掩模数据的增加。

公开(公告)号：US07948086B2

公开(公告)日：2011-05-24

申请号：US12714596

申请日：2010-03-01

申请人： Kenichi Kuroda ,  Kozo Watanabe ,  Hirohiko Yamamoto

发明人： Kenichi Kuroda ,  Kozo Watanabe ,  Hirohiko Yamamoto

IPC分类号： H01L23/48

CPC分类号： H01L23/5283 ,  H01L21/31053 ,  H01L21/74 ,  H01L21/76224 ,  H01L21/76229 ,  H01L23/522 ,  H01L23/528 ,  H01L23/53228 ,  H01L27/0207 ,  H01L27/11807 ,  H01L29/0649 ,  H01L29/0653 ,  H01L29/0692 ,  H01L29/4925 ,  H01L2924/0002 ,  H01L2924/00

摘要： There is provided a technique for improving the flatness at the surface of members embedded in a plurality of recesses without resulting in an increase in the time required for the manufacturing processes. According to this technique, the dummy patterns can be placed up to the area near the boundary BL between the element forming region DA and dummy region FA by placing the first dummy pattern DP1 of relatively wider area and the second dummy pattern DP2 of relatively small area in the dummy region FA. Thereby, the flatness of the surface of the silicon oxide film embedded within the isolation groove can be improved over the entire part of the dummy region FA. Moreover, an increase of the mask data can be controlled when the first dummy patterns DP1 occupy a relatively wide region among the dummy region FA.

摘要翻译： 提供了一种用于改善嵌入在多个凹部中的构件的表面处的平坦度而不导致制造过程所需时间增加的技术。 根据该技术，通过将相对较宽区域的第一伪图案DP1和相对较小面积的第二虚设图案DP2放置在元件形成区域DA和虚拟区域FA之间的边界BL附近的虚拟图案， 在虚拟区域FA中。 由此，可以在虚拟区域FA的整个部分改善嵌入在隔离槽内的氧化硅膜的表面的平坦度。 此外，当第一伪图案DP1占据虚拟区域FA中相对较宽的区域时，可以控制掩模数据的增加。

公开(公告)号：US07589423B2

公开(公告)日：2009-09-15

申请号：US11802623

申请日：2007-05-24

申请人： Kenichi Kuroda ,  Kozo Watanabe ,  Hirohiko Yamamoto

发明人： Kenichi Kuroda ,  Kozo Watanabe ,  Hirohiko Yamamoto

IPC分类号： H01L23/48

CPC分类号： H01L23/5283 ,  H01L21/31053 ,  H01L21/74 ,  H01L21/76224 ,  H01L21/76229 ,  H01L23/522 ,  H01L23/528 ,  H01L23/53228 ,  H01L27/0207 ,  H01L27/11807 ,  H01L29/0649 ,  H01L29/0653 ,  H01L29/0692 ,  H01L29/4925 ,  H01L2924/0002 ,  H01L2924/00

摘要： There is provided a technique for improving the flatness at the surface of members embedded in a plurality of recesses without resulting in an increase in the time required for the manufacturing processes. According to this technique, the dummy patterns can be placed up to the area near the boundary BL between the element forming region DA and dummy region FA by placing the first dummy pattern DP1 of relatively wider area and the second dummy pattern DP2 of relatively small area in the dummy region FA. Thereby, the flatness of the surface of the silicon oxide film embedded within the isolation groove can be improved over the entire part of the dummy region FA. Moreover, an increase of the mask data can be controlled when the first dummy patterns DP1 occupy a relatively wide region among the dummy region FA.

摘要翻译： 提供了一种用于改善嵌入在多个凹部中的构件的表面处的平坦度而不导致制造过程所需时间增加的技术。 根据该技术，通过将相对较宽区域的第一伪图案DP1和相对较小面积的第二虚设图案DP2放置在元件形成区域DA和虚拟区域FA之间的边界BL附近的虚拟图案， 在虚拟区域FA中。 由此，可以在虚拟区域FA的整个部分改善嵌入在隔离槽内的氧化硅膜的表面的平坦度。 此外，当第一伪图案DP1占据虚拟区域FA中相对较宽的区域时，可以控制掩模数据的增加。

公开(公告)号：US07411302B2

公开(公告)日：2008-08-12

申请号：US11430983

申请日：2006-05-10

申请人： Kenichi Kuroda ,  Kozo Watanabe ,  Hirohiko Yamamoto

发明人： Kenichi Kuroda ,  Kozo Watanabe ,  Hirohiko Yamamoto

IPC分类号： H01L23/48

CPC分类号： H01L23/5283 ,  H01L21/31053 ,  H01L21/74 ,  H01L21/76224 ,  H01L21/76229 ,  H01L23/522 ,  H01L23/528 ,  H01L23/53228 ,  H01L27/0207 ,  H01L27/11807 ,  H01L29/0649 ,  H01L29/0653 ,  H01L29/0692 ,  H01L29/4925 ,  H01L2924/0002 ,  H01L2924/00

摘要： There is provided a technique for improving the flatness at the surface of members embedded in a plurality of recesses without resulting in an increase in the time required for the manufacturing processes. According to this technique, the dummy patterns can be placed up to the area near the boundary BL between the element forming region DA and dummy region FA by placing the first dummy pattern DP1 of relatively wider area and the second dummy pattern DP2 of relatively small area in the dummy region FA. Thereby, the flatness of the surface of the silicon oxide film embedded within the isolation groove can be improved over the entire part of the dummy region FA. Moreover, an increase of the mask data can be controlled when the first dummy patterns DP1 occupy a relatively wide region among the dummy region FA.

公开(公告)号：US20080028134A1

公开(公告)日：2008-01-31

申请号：US11860762

申请日：2007-09-25

申请人： Kiyoshi MATSUBARA ,  Naoki Yashiki ,  Shiro Baba ,  Takashi Ito ,  Hirofumi Mukai ,  Masanao Sato ,  Masaaki Terasawa ,  Kenichi Kuroda ,  Kazuyoshi Shiba

发明人： Kiyoshi MATSUBARA ,  Naoki Yashiki ,  Shiro Baba ,  Takashi Ito ,  Hirofumi Mukai ,  Masanao Sato ,  Masaaki Terasawa ,  Kenichi Kuroda ,  Kazuyoshi Shiba

IPC分类号： G06F13/00

CPC分类号： H01L27/11526 ,  G06F9/445 ,  G06F15/7814 ,  G06F15/7821 ,  G11C7/1045 ,  G11C16/0416 ,  G11C16/102 ,  G11C16/105 ,  G11C16/12 ,  G11C16/16 ,  G11C16/26 ,  G11C16/30 ,  G11C16/3418 ,  G11C16/3427 ,  G11C16/3445 ,  G11C16/3459 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11531 ,  H01L27/11546 ,  Y02D10/43

摘要： A semiconductor device having an electrically erasable and programmable nonvolatile memory, for example, a rewritable nonvolatile memory including memory cells arranged in rows and columns and disposed to facilitate both flash erasure as well as selective erasure of individual units of plural memory cells. The semiconductor device which functions as a microcomputer chip also has a processing unit and includes an input terminal for receiving an operation mode signal for switching the microcomputer between a first operation mode in which the flash memory is rewritten under control of a processing unit and a second operation mode in which the flash memory is rewritten under control of separate writing circuit externally connectable to the microcomputer.

摘要翻译： 具有电可擦除和可编程非易失性存储器的半导体器件，例如，包括以行和列布置的存储器单元的可重写非易失性存储器，并且被设置为便于闪存擦除以及多个存储器单元的各个单元的选择性擦除。 用作微计算机芯片的半导体器件还具有处理单元，并且包括：输入端子，用于在处理单元的控制下在闪速存储器被重写的第一操作模式和第二操作模式之间接收用于切换微型计算机的操作模式信号 操作模式，其中在外部连接到微型计算机的分离的写入电路的控制下闪存被重写。

公开(公告)号：US07071560B2

公开(公告)日：2006-07-04

申请号：US10748139

申请日：2003-12-31

申请人： Kenichi Kuroda ,  Kozo Watanabe ,  Hirohiko Yamamoto

发明人： Kenichi Kuroda ,  Kozo Watanabe ,  Hirohiko Yamamoto

IPC分类号： H01L23/48

CPC分类号： H01L23/5283 ,  H01L21/31053 ,  H01L21/74 ,  H01L21/76224 ,  H01L21/76229 ,  H01L23/522 ,  H01L23/528 ,  H01L23/53228 ,  H01L27/0207 ,  H01L27/11807 ,  H01L29/0649 ,  H01L29/0653 ,  H01L29/0692 ,  H01L29/4925 ,  H01L2924/0002 ,  H01L2924/00

摘要： There is provided a technique for improving the flatness at the surface of members embedded in a plurality of recesses without resulting in an increase in the time required for the manufacturing processes. According to this technique, the dummy patterns can be placed up to the area near the boundary BL between the element forming region DA and dummy region FA by placing the first dummy pattern DP1 of relatively wider area and the second dummy pattern DP2 of relatively small area in the dummy region FA. Thereby, the flatness of the surface of the silicon oxide film embedded within the isolation groove can be improved over the entire part of the dummy region FA. Moreover, an increase of the mask data can be controlled when the first dummy patterns DP1 occupy a relatively wide region among the dummy region FA.

公开(公告)号：US07067888B2

公开(公告)日：2006-06-27

申请号：US09985303

申请日：2001-11-02

申请人： Hideki Aono ,  Kousuke Okuyama ,  Kozo Watanabe ,  Kenichi Kuroda

发明人： Hideki Aono ,  Kousuke Okuyama ,  Kozo Watanabe ,  Kenichi Kuroda

IPC分类号： H01L29/772

CPC分类号： H01L27/092 ,  H01L21/823807 ,  H01L21/823814 ,  H01L27/105

摘要： Semiconductor regions for the suppression of short channel effects are not provided for a pMIS and an nMIS that constitute an inverter circuit of an input first stage of an I/O buffer circuit, whereas semiconductor regions for the suppression of short channel effects are provided for pMIS and nMIS of inverter circuits of the next stage of an I/O buffer circuit.

摘要翻译： 对于构成I / O缓冲电路的输入第一级的反相器电路的pMIS和nMIS，不提供用于抑制短信道效应的半导体区域，而为pMIS提供用于抑制短信道效应的半导体区域 和I / O缓冲电路的下一级的反相器电路的nMIS。

公开(公告)号：US06815748B2

公开(公告)日：2004-11-09

申请号：US10761311

申请日：2004-01-22

申请人： Koichiro Ishibashi ,  Shuji Ikeda ,  Harumi Wakimoto ,  Kenichi Kuroda

发明人： Koichiro Ishibashi ,  Shuji Ikeda ,  Harumi Wakimoto ,  Kenichi Kuroda

IPC分类号： H01L27108

CPC分类号： H01L27/092

摘要： The metal layers embedded into the contact holes of various kinds in shape are used as the lines and are employed as the lines for controlling the substrate bias. The first-layer metal line layers are made thin so as to be also employed as the lines for controlling the substrate bias. Moreover, the second-layer metal line layers are employed as the copper line layers. Thereby, a semiconductor integrated circuit which allows a high-speed and low-power operation is provided with a small area and without increasing the number of the masks.