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公开(公告)号：US11448432B2
公开(公告)日：2022-09-20
申请号：US16163161
申请日：2018-10-17
Inventor： Igor Vaisman , Steve T. Gagne , Kyle Burkholder
Abstract: A cooling system includes a heat exchanger through which a refrigerant flows, the heat exchanger having a fluid passing therethrough such that heat is rejected to the fluid, an evaporator, a refrigerant piping split point that receives the refrigerant at a given pressure from the heat exchanger and splits the refrigerant flow into a first circuit and a second circuit, the first circuit having an expansion valve that receives the refrigerant at the given pressure, and the second circuit having a first turbine coupled to a first compressor, wherein the first turbine receives the refrigerant at the given pressure, and a set of valves arranged to direct the refrigerant through the first circuit, the second circuit, or both the first and second circuits based on ambient conditions of the cooling system.
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公开(公告)号：US11421308B2
公开(公告)日：2022-08-23
申请号：US16493260
申请日：2018-01-11
Applicant: LG ELECTRONICS INC.
Inventor： Seokpyo Hong
Abstract: The present invention relates to an air conditioner. The air conditioner according to the present embodiment has a refrigeration capacity of 2 kW to 7 kW, inclusive, and uses R410a as a refrigerant circulating therein, and since a refrigerant pipe therein includes a ductile stainless steel pipe made of a material containing, at least, chrome (Cr), nickel (Ni), manganese (Mn) and copper (Cu), the refrigerant pipe can maintain strength and hardness as good as or better than those of a copper pipe, while also maintaining good processability.
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公开(公告)号：US11408647B2
公开(公告)日：2022-08-09
申请号：US16778440
申请日：2020-01-31
Applicant: CARRIER CORPORATION
Inventor： Frederick J. Cogswell , Yinshan Feng , Parmesh Verma , Hongsheng Liu , Dhruv Chanakya Hoysall
Abstract: A refrigerated system includes a heat recovery system defining a heat recovery fluid flow path. The heat recovery system includes an ejector having a primary inlet and a secondary inlet and a first heat exchanger within which heat is transferred between a heat recovery fluid and a secondary fluid. The first heat exchanger is located upstream from the primary inlet of the ejector. A second heat exchanger within which heat is transferred from a heat transfer fluid to the heat recovery fluid is upstream from the secondary inlet of the ejector. At least one recovery heat exchanger is positioned along the heat recovery fluid flow path directly upstream from the first heat exchanger.
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公开(公告)号：US11340000B2
公开(公告)日：2022-05-24
申请号：US16461937
申请日：2017-11-15
Applicant: Danfoss A/S
Inventor： Frede Schmidt , Jan Prins , Kristian Fredslund , Kenneth Bank Madsen
Abstract: A method for controlling a vapour compression system (1) is disclosed. A mass flow of refrigerant along a part of the refrigerant path is estimated, based on measurements performed by one or more pressure sensors (10, 12, 13) for measuring a refrigerant pressure at selected positions along the refrigerant path and one or more temperature sensors (11, 14) for measuring a refrigerant temperature at selected positions along the refrigerant path. A refrigerant pressure or a refrigerant temperature at a selected position a pressure sensor (10, 12, 13) or temperature sensor (11, 14) along the refrigerant path is derived, based on the estimated mass flow. The vapour compression system (1) is allowed to continue operating, even if a sensor (10, 11, 12, 13, 14) is malfunctioning or unreliable.
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公开(公告)号：US20220107124A1
公开(公告)日：2022-04-07
申请号：US17065117
申请日：2020-10-07
Applicant: Emerson Climate Technologies, Inc.
Inventor： Babak ATTARI , Reza KHATAMI
Abstract: A system includes a heat-pump circuit and a heating-fluid circuit. The heat-pump circuit includes a compressor and a first condenser conduit. The heating-fluid circuit includes first, second, and third flow-paths. The third flow-path selectively communicates with the first and second flow-paths. The first flow-path includes a first valve. The first valve moves between an open position allowing fluid flow through the first flow-path and a closed position restricting fluid flow through the first flow-path. The second flow-path includes a second condenser conduit and a second valve. When the second valve is open, fluid flows through the second flow-path. In the closed position, the second valve restricts fluid flow through the second flow-path. The third flow-path includes a heat exchanger receiving fluid from the first flow-path when the first valve is in the open position and receiving fluid from the second flow-path when the second valve is in the open position.
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公开(公告)号：US20220026115A1
公开(公告)日：2022-01-27
申请号：US16939262
申请日：2020-07-27
Applicant: Heatcraft Refrigeration Products LLC
Inventor： Shitong Zha
Abstract: A cooling system implements various processes to improve efficiency in high ambient temperatures. First, the system can flood one or more low side heat exchangers in the system. Second, the system can direct a portion of vapor refrigerant from a low side heat exchanger to a flash tank rather than to a compressor. Third, the system can transfer heat from refrigerant at a compressor suction to refrigerant at the discharge of a high side heat exchanger.
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公开(公告)号：US20220018588A1
公开(公告)日：2022-01-20
申请号：US16932587
申请日：2020-07-17
Applicant: Alessandro Grasseschi
Inventor： Alessandro Grasseschi
Abstract: A hybrid cooling storage device, including a main body to store at least one item therein, a lid pivotally disposed on at least a portion of the main body to cover an interior portion of the main body, and a hybrid cooling unit disposed on and within at least a portion of the main body, including a liquid conduit disposed within at least a portion of each side of the main body to transport a liquid therein, a conduit connector connected to a first end and a second end of the liquid conduit to dissipate heat from the liquid received from the liquid conduit, a peltier plate disposed on at least a portion of the conduit connector to create a difference in temperature between a first side and a second side of the peltier plate, such that the first side is cold and the second side is hot, a heat sink disposed on at least a portion of the peltier plate to dissipate heat generated on the peltier plate, and a fan disposed on at least a portion of the heat sink to extract heat from the heat sink via a rotation of the fan.
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公开(公告)号：US20220011835A1
公开(公告)日：2022-01-13
申请号：US16925082
申请日：2020-07-09
Applicant: Nvidia Corporation
Inventor： Ali Heydari
Abstract: A cooling system for a datacenter is disclosed. A multiple mode cooling subsystem of the cooling system has a form factor for one or more racks of the datacenter, has two or more different cooling systems, and is adjustable to different cooling requirements of the datacenter within different cooling capacities offered by the two or more different cooling systems.
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公开(公告)号：US11209191B2
公开(公告)日：2021-12-28
申请号：US15385043
申请日：2016-12-20
Applicant: Carrier Corporation
Inventor： Jinliang Wang , Parmesh Verma , Frederick J. Cogswell
Abstract: A system has a first compressor and a second compressor. A heat rejection heat exchanger is coupled to the first and second compressors to receive refrigerant compressed by the compressors. The system includes an economizer for receiving refrigerant from the heat rejection heat exchanger and reducing an enthalpy of a first portion of the received refrigerant while increasing an enthalpy of a second portion. The second portion is returned to the compressor. The ejector has a primary inlet coupled to the means to receive a first flow of the reduced enthalpy refrigerant. The ejector has a secondary inlet and an outlet. The outlet is coupled to the first compressor to return refrigerant to the first compressor. A first heat absorption heat exchanger is coupled to the economizer to receive a second flow of the reduced enthalpy refrigerant and is upstream of the secondary inlet of the ejector. A second heat absorption heat exchanger is between the outlet of the ejector and the first compressor.
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公开(公告)号：US11204181B2
公开(公告)日：2021-12-21
申请号：US16371181
申请日：2019-04-01
Inventor： Mikihito Tokudi , Gen Yasuda , Takanori Isogawa , Kazuhiro Tsuchihashi , Hiroyuki Ogisu
Abstract: An air conditioner provided which has: a main refrigerant circuit including a compressor, a heat source side heat exchanger, a first expansion valve, and a utilization side heat exchanger and configured such that refrigerant flows in the main refrigerant circuit; a sub refrigerant circuit including a cooling member configured such that refrigerant branched from the main refrigerant circuit flows in the cooling member and configured such that refrigerant branched from the main refrigerant circuit flows in the sub refrigerant circuit; and a heat generator to be cooled by the cooling member, wherein a pipe in which part of refrigerant discharged from the compressor flows is connected to the cooling member of the sub refrigerant circuit.
