Ultrasonic Testing Device and Ultrasonic Testing Method

    公开(公告)号:US20220283124A1

    公开(公告)日:2022-09-08

    申请号:US17636664

    申请日:2020-08-18

    摘要: Provided is an ultrasonic testing device with which it is possible to suitably detect internal defects in an article to be tested. For this purpose, the ultrasonic testing device comprises: an ultrasonic probe that generates ultrasonic waves and transmits the same to the article to be tested, and that receives reflected waves reflected from the article to be tested; and a computation processing unit. The computation processing unit: (A) sets a gate indicating a start time and a time duration for a subject of analysis of the reflected waves; (B) as pertains to each of a plurality of measurement points, (B1) acquires a reflection signal indicating the intensity of the reflected waves at each time, (B2) calculates a difference signal that is the difference between the reflection signal and a reference signal, and (B3) calculates a feature amount with respect to the difference signal within the gate; (C) detects defects on the basis of the feature amounts for the plurality of measurement points; and (D) outputs information indicating the depth of the defects along the transmission direction of the ultrasonic waves.

    Ultrasonic inspection device
    12.
    发明授权

    公开(公告)号:US11428673B2

    公开(公告)日:2022-08-30

    申请号:US16346585

    申请日:2017-09-08

    发明人: Toru Matsumoto

    摘要: Provided is an ultrasonic inspection device for inspecting a packaged semiconductor device, The ultrasonic inspection device including an ultrasonic transducer that is disposed to face the semiconductor device; a medium holding unit that is provided at an end of the ultrasonic transducer facing the semiconductor device and holds a medium through which ultrasonic waves are propagated; a stage that moves the position of the semiconductor device relative to the ultrasonic transducer; and an analysis unit that analyzes the reaction of the semiconductor device in accordance with input of the ultrasonic waves from the ultrasonic transducer.

    Non-destructive Inspection Of Test Objects On A Workpiece

    公开(公告)号:US20220268740A1

    公开(公告)日:2022-08-25

    申请号:US17595247

    申请日:2019-05-13

    申请人: ABB Schweiz AG

    IPC分类号: G01N29/22 G01N29/28 G01N29/04

    摘要: A method for non-destructive inspection of at least one test object on a workpiece includes the steps of: obtaining a theoretical position of each test object in relation to a testing robot; capturing an image of each test object to obtain image data; determining a real position of each test object in relation to the testing robot on the basis of the image data; and bringing a sensor carried by the testing robot in contact with each test object to obtain a respective test measurement. For the certain type of inspection where the test instrument needs to be brought in physical contact with the test object to be inspected, it is crucial to know the exact position of the test object. As soon as the approximate position of the test object is known an image of the test object can be captured, and the exact position of the test object can be extracted from the respective image data.

    Dynamic adjustment of phased array parameters for ultrasonic inspection

    公开(公告)号:US11415558B2

    公开(公告)日:2022-08-16

    申请号:US17128112

    申请日:2020-12-20

    摘要: A method of ultrasonic inspection includes generating, by a phased array ultrasonic probe, a first ultrasonic beam propagating in a fluid and incident at a first angle to a target surface in response to receipt of first instructions. Ultrasonic echoes from first beam reflection by the target are measured and corresponding ultrasonic measurement signals are output. At least one environmental sensor measures at least one fluid property and outputs corresponding environmental signals. One or more processors determine a current speed of sound within the fluid from the ultrasonic measurement signals and environmental signals. Second instructions including a second angle are generated by the processors, based on the current speed of sound, when the current speed of sound differs from a predetermined speed of sound by more than a speed threshold. The ultrasonic probe generates a second ultrasonic beam at the second angle in response to receipt of the second instructions.

    MEASUREMENT PROBE
    16.
    发明申请

    公开(公告)号:US20220178885A1

    公开(公告)日:2022-06-09

    申请号:US17552037

    申请日:2021-12-15

    申请人: RENISHAW PLC

    发明人: Liam HALL

    摘要: An ultrasound probe is described that comprises a transducer for transmitting and receiving ultrasound. The probe also includes a coupling element, such as a spherical ball of self-lubricating or hydrogel material, for contacting and acoustically coupling to an object to be inspected. The ultrasound probe also includes an analyser that is arranged to analyse the ultrasound signal received by the transducer and thereby determine if there is contact between the coupling element, and the surface of an object. The probe can thus be used for internal (ultrasound) inspection of objects as well as measuring the position of points on the surface of the object. The probe may be mountable to a coordinate measuring machine or other moveable platforms.

    Apparatus, system, and method for ultrasonic inspection of a variable radius joint

    公开(公告)号:US11313839B2

    公开(公告)日:2022-04-26

    申请号:US16716135

    申请日:2019-12-16

    发明人: Kareem Shehab

    IPC分类号: G01N29/28 G01N29/265

    摘要: Disclosed herein is an apparatus for ultrasonic inspection that comprises a base and a contact shoe that is located within the base and movably coupled to the base. The apparatus additionally comprises a sensor carriage located within the contact shoe and movably coupled to the contact shoe such that the sensor carriage is translationally movable relative to the contact shoe. The apparatus further comprises a linkage pivotably coupled to the base at a base pivot point, pivotably coupled to the contact shoe at a shoe pivot point, and pivotably coupled to the sensor carriage at a carriage pivot point. Translational movement of the contact shoe relative to the base causes the linkage to pivot about the base pivot point, the shoe pivot point, and the carriage pivot point and move the sensor carriage relative to the base and the contact shoe.

    Systems and methods of capturing transient elastic vibrations in bodies using arrays of transducers for increased signal to noise ratio and source directionality

    公开(公告)号:US11249054B2

    公开(公告)日:2022-02-15

    申请号:US16783802

    申请日:2020-02-06

    摘要: Provided herein are systems and methods for real time processing of signals from an array of transducers for detecting transient elastic waves originating from unknown locations in a body, which may propagate in a dispersive fashion. The systems and methods allow real time combination and analysis of signals, including decisions regarding storage as new data is received. The methods described herein include designing arrays of detectors and methods for processing signals in real time given the constraints of the body under test determining whether to store the set of information while a new set of information is received for processing within a real time environment. The methods described herein include methods which result in the determination or small time shifts which place all signals into a coherent time base which are then combined achieving a composite waveform that possesses an increased signal-to-noise ratio over any single element.

    Ultrasonic Transducer and Method of Fabricating an Ultrasonic Transducer

    公开(公告)号:US20220013103A1

    公开(公告)日:2022-01-13

    申请号:US17478894

    申请日:2021-09-18

    摘要: An ultrasonic transducer that includes a delay line, an active piezoelectric element, and interposing metal conductive layer between the delay line and active piezoelectric element. The delay line and active piezoelectric element are joined so that ultrasonic waves may be coupled from the active piezoelectric element into the delay line or from the delay line into the active piezoelectric element. A via is formed, using a milling operation, in the active piezoelectric element to expose the edge of the interposing metal conductive layer between the delay line and active piezoelectric element. A conductive layer makes electrical contact between the interposing metal conductive layer and the surface of the active piezoelectric element to allow an electrical connection to be made from the surface of the active piezoelectric element to the interposing metal conductive layer.