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公开(公告)号：US20190264070A1
公开(公告)日：2019-08-29
申请号：US16346045
申请日：2017-10-24
发明人： Koji MAKIHARA
IPC分类号： C09J9/02 , C09J163/00 , C08K3/013 , C08K3/22 , H01L21/52
摘要： A thermally conductive paste of the present invention includes a thermosetting resin and a thermally conductive filler, a ratio of a wet spreading area is 90% or more, and when an average particle size D50 of the thermally conductive filler is referred to as D, a viscosity of the thermally conductive paste excluding the thermally conductive filler at room temperature 25° C. is referred to as η, and a degree of sedimentation of the thermally conductive filler in the thermally conductive paste is referred to as S=D2/η, S is 8 [10−12·m3·s/kg] or more and 900 [10−12·m3·s/kg] or less.
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公开(公告)号：US10363397B2
公开(公告)日：2019-07-30
申请号：US14779480
申请日：2014-03-26
发明人： Kenichi Kanemasa , Shinetsu Harata , Yoshihiro Abe , Hayao Tanaka , Masao Ikeda , Keiji Kamada
摘要： A catheter of the invention includes an elongated flexible tubular main body; a plurality of manipulation wires inserted through the tubular main body and having tips connected to a distal part of the tubular main body; a manipulation-part main body provided at a base end of the tubular main body; and a bending manipulation part. The bending manipulation part has an engagement part engaging with base ends of the manipulation wires, and individually applies pulling force to the plurality of manipulation wires through pulling operations so as to bend the distal part of the tubular main body. The bending manipulation part is provided so as to be movable with respect to the manipulation-part main body. The path lengths of the plurality of manipulation wires from the tips thereof to the engagement part are simultaneously increased or decreased when the bending manipulation part and the manipulation-part main body move relative to each other.
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公开(公告)号：US10224259B2
公开(公告)日：2019-03-05
申请号：US14898966
申请日：2014-06-11
发明人： Yui Ozaki , Katsushi Yamashita , Tomomasa Kashino
IPC分类号： C08K3/36 , H01L23/29 , H01L23/495 , C08G73/02 , C08K5/357 , C08K5/3445 , C08K5/378 , C08K5/548 , H01L21/56 , H01L29/16 , H01L29/20 , C08G73/12 , C08K5/35 , H01L23/31
摘要： The resin composition for sealing semiconductor according to the present invention is characterized by containing a maleimide-based compound represented by the following general formula (1), at least one of the benzoxazine-based compounds represented by the following general formula (2-1) and the following general formula (2-2), a curing catalyst, and an inorganic filler.In the general formulae (1), (2-1) and (2-2), each of X2, X3 and X4 independently represents an alkylene group having 1 to 10 carbon atoms, a group represented by the following general formula (3), a group represented by the formula “—SO2—” or “—CO—”, an oxygen atom or a single bond.
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24.发明申请公开(公告)号：US20190010416A1
公开(公告)日：2019-01-10
申请号：US15753830
申请日：2016-08-31
发明人： Yuji Suzuki
IPC分类号： C10M107/30 , C08G8/20 , C08L61/12
摘要： Provided is a liquid phenolic resol resin containing a partial structure represented by General Formula (P-1) [in the formula, R1, R2 and R3 each independently represent a hydrogen atom or —CH2OH, R4 represents a linear unsaturated hydrocarbon group having 10 or more carbon atoms, and * represents a bond].
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公开(公告)号：US10174148B2
公开(公告)日：2019-01-08
申请号：US15041070
申请日：2016-02-11
发明人： Todd Warakomski , Matsuo Yoshihiro
摘要： A process for the production of high compressive strength microspheres of cured phenolic resins are disclosed. Specifically, the microspheres formed by this process exhibit excellent viscoelastic properties in that the microspheres retain their shape even after applying a load of at least 4 GPa at 2.5 percent strain, and exhibit high hardness of at least about 0.3 GPa.
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公开(公告)号：US10155863B2
公开(公告)日：2018-12-18
申请号：US15522229
申请日：2015-10-05
发明人： Yusuke Watanabe
摘要： There is provided a phenolic resin composition as a molding material. It includes a resol-type phenolic resin (A) and a novolac-type phenolic resin (B). The novolac-type phenolic resin (B) includes a novolac-type phenolic resin (B1) represented by General Formula (1) and a modified novolac-type phenolic resin (B2) represented by General Formula (2).
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27.发明申请公开(公告)号：US20180340101A1
公开(公告)日：2018-11-29
申请号：US15546147
申请日：2016-01-27
发明人： Yasuo SHIMOBE , Ryuichi MURAYAMA , Koji MAKIHARA
IPC分类号： C09J9/02 , C09J11/04 , C09J133/04 , C09J163/00 , C09J201/00 , H01L21/52 , H01L23/00
CPC分类号： C09J9/02 , C09J11/04 , C09J133/04 , C09J163/00 , C09J201/00 , C09J2203/326 , C09J2205/102 , H01L21/52 , H01L24/07 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A paste-like adhesive composition of the present invention contains metal particles (A) and a thermally polymerizable compound (B), in which the metal particles (A) form a particle coupling structure by causing sintering through a thermal treatment; when dynamic viscoelasticity of the composition is measured under a condition of a measurement frequency of 1 Hz, within a temperature region of 140° C. to 180° C., the composition has a temperature width of equal to or larger than 10° C. in which a shear modulus of elasticity is equal to or higher than 5,000 Pa and equal to or lower than 100,000 Pa; and an acetone insoluble fraction of a sample, which is obtained by removing the metal particles (A) and then heating the composition under conditions of 180° C. and 2 hours, is equal to or lower than 5% by weight.
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公开(公告)号：US10079188B2
公开(公告)日：2018-09-18
申请号：US15537088
申请日：2016-01-20
发明人： Naoki Tomida , Kazuhiko Dakede
IPC分类号： H01L23/29 , B60R16/02 , C08K3/36 , C08K5/3445 , C08L101/00 , H05K3/28 , C08L101/12 , H01L23/31
CPC分类号： H01L23/295 , B60R16/02 , C08K3/36 , C08K5/3445 , C08L101/00 , C08L101/12 , H01L23/293 , H01L23/3107 , H05K3/28 , H05K3/285 , H05K2203/1316 , C08L63/00
摘要： Provided is a resin composition for encapsulating which is used for forming an encapsulating resin of an on-vehicle electronic control unit including a wiring substrate, a plurality of electronic components mounted on the wiring substrate, and the encapsulating resin encapsulating the electronic component, the resin composition including: a thermosetting resin; and one or more imidazole compounds, in which when a torque value is measured over time under conditions of the number of rotations of 30 rpm and a measurement temperature of 175° C. by using Labo Plastomill, a time T1 at which the torque value is less than or equal to 2 times a minimum torque value is longer than or equal to 15 seconds and shorter than or equal to 100 seconds, and the minimum torque value is greater than or equal to 0.5 N·m and less than or equal to 2.5 N·m.
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公开(公告)号：US20180245115A1
公开(公告)日：2018-08-30
申请号：US15758593
申请日：2016-09-27
发明人： Masaaki TOYODA
CPC分类号： C12P19/04 , C12M21/00 , C12M21/18 , G01N33/543 , G01N33/68 , G01N2400/02 , G01N2440/38
摘要： Provided is a method for preparing a glycoprotein sugar chain including: an isolation step of acting a sugar chain-isolating enzyme on a sample which contains a glycoprotein fixed to a solid phase in a container to obtain an isolated product which contains a sugar chain; and a labeling step of adding a labeling reagent to the isolated product in the container to obtain a labeled product which contains a labeled substance of the sugar chain.
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公开(公告)号：US10059793B2
公开(公告)日：2018-08-28
申请号：US15524349
申请日：2015-11-18
CPC分类号： C08G8/24 , C07G1/00 , C08L97/00 , C08L97/005 , C09D197/005
摘要： Provided is a lignin resin composition including a lignin derivative having a weight-average molecular weight of 500 or more and 4000 or less and a novolac-type phenolic resin having a weight-average molecular weight of 1000 or more and 3000 or less, in which the content of the lignin derivative is not higher than the content of the novolac-type phenolic resin. In particular, the cured product (molded product) of a lignin resin composition obtained by melt-mixing such a lignin resin composition, adding hexamethylenetetramine thereto and then heating the resulting mixture has a high bending strength. Such a lignin resin composition is utilizable as a thermosetting resin substituting a phenolic resin.
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