Methods and semiconductor structures for latch-up suppression using a conductive region
    24.
    发明授权
    Methods and semiconductor structures for latch-up suppression using a conductive region 失效
    使用导电区域进行闩锁抑制的方法和半导体结构

    公开(公告)号:US07727848B2

    公开(公告)日:2010-06-01

    申请号:US12169806

    申请日:2008-07-09

    IPC分类号: H01L21/331

    摘要: Semiconductor structures and methods for suppressing latch-up in bulk CMOS devices. The semiconductor structure comprises first and second adjacent doped wells formed in the semiconductor material of a substrate. A trench, which includes a base and first sidewalls between the base and the top surface, is defined in the substrate between the first and second doped wells. The trench is partially filled with a conductor material that is electrically coupled with the first and second doped wells. Highly-doped conductive regions may be provided in the semiconductor material bordering the trench at a location adjacent to the conductive material in the trench.

    摘要翻译: 用于抑制大量CMOS器件中的闩锁的半导体结构和方法。 半导体结构包括形成在衬底的半导体材料中的第一和第二相邻的掺杂阱。 在第一和第二掺杂阱之间的衬底中限定了包括基底和基底与顶表面之间的第一侧壁的沟槽。 沟槽部分地填充有与第一和第二掺杂阱电耦合的导体材料。 可以在与沟槽中的导电材料相邻的位置处与沟槽邻接的半导体材料中提供高度掺杂的导电区域。

    Method of forming a dual gated FinFET gain cell
    26.
    发明授权
    Method of forming a dual gated FinFET gain cell 有权
    形成双门控FinFET增益单元的方法

    公开(公告)号:US07566613B2

    公开(公告)日:2009-07-28

    申请号:US11221118

    申请日:2005-09-07

    IPC分类号: H01L21/8244

    摘要: A memory gain cell for a memory circuit, a memory circuit formed from multiple memory gain cells, and methods of fabricating such memory gain cells and memory circuits. The memory gain cell includes a storage device capable of holding a stored electrical charge, a write device, and a read device. The read device includes a fin of semiconducting material, electrically-isolated first and second gate electrodes flanking the fin, and a source and drain formed in the fin adjacent to the first and the second gate electrodes. The first gate electrode is electrically coupled with the storage device. The first and second gate electrodes are operative for gating a region of the fin defined between the source and the drain to thereby regulate a current flowing from the source to the drain. When gated, the magnitude of the current is dependent upon the electrical charge stored by the storage device.

    摘要翻译: 用于存储器电路的存储增益单元,由多个存储器增益单元形成的存储器电路,以及制造这种存储器增益单元和存储器电路的方法。 存储器增益单元包括能够保存存储的电荷的存储装置,写入装置和读取装置。 读取装置包括半导体材料的翅片,鳍片侧面的电隔离的第一和第二栅电极,以及形成在与第一和第二栅电极相邻的鳍片中的源极和漏极。 第一栅电极与存储装置电耦合。 第一和第二栅极电极用于选通限定在源极和漏极之间的鳍片的区域,从而调节从源极流到漏极的电流。 当门控时,电流的大小取决于存储设备存储的电量。

    DIGITAL CIRCUITS HAVING ADDITIONAL CAPACITORS FOR ADDITIONAL STABILITY
    27.
    发明申请
    DIGITAL CIRCUITS HAVING ADDITIONAL CAPACITORS FOR ADDITIONAL STABILITY 审中-公开
    具有附加电容器的数字电路用于额外的稳定性

    公开(公告)号:US20090001481A1

    公开(公告)日:2009-01-01

    申请号:US11768270

    申请日:2007-06-26

    IPC分类号: H01L27/105 H01L21/8238

    摘要: A semiconductor structure and a method for forming the same. The semiconductor structure includes (a) a semiconductor substrate, (b) a shallow trench isolation (STI) region on the semiconductor substrate, and (c) a first semiconductor transistor on the semiconductor substrate. The first semiconductor transistor includes (I) a first source/drain region, (ii) a second source/drain region, and (iii) a first gate electrode region. The first and second source/drain regions are doped with a same doping polarity. The semiconductor structure further includes a first doped region in the semiconductor substrate. The first doped region is on a first side wall and a bottom wall of the STI region. The first doped region is in direct physical contact with the second source/drain region. The first doped region and the second source/drain region are doped with a same doping polarity.

    摘要翻译: 半导体结构及其形成方法。 半导体结构包括(a)半导体衬底,(b)半导体衬底上的浅沟槽隔离(STI)区域,以及(c)半导体衬底上的第一半导体晶体管。 第一半导体晶体管包括(I)第一源极/漏极区域,(ii)第二源极/漏极区域,以及(iii)第一栅极电极区域。 第一和第二源/漏区掺杂相同的掺杂极性。 半导体结构还包括在半导体衬底中的第一掺杂区域。 第一掺杂区域位于STI区域的第一侧壁和底壁上。 第一掺杂区域与第二源极/漏极区域直接物理接触。 第一掺杂区域和第二源极/漏极区域掺杂相同的掺杂极性。

    High performance single event upset hardened SRAM cell
    29.
    发明授权
    High performance single event upset hardened SRAM cell 有权
    高性能单事件硬化SRAM单元

    公开(公告)号:US07397692B1

    公开(公告)日:2008-07-08

    申请号:US11612809

    申请日:2006-12-19

    IPC分类号: G11C11/00

    CPC分类号: G11C11/4125

    摘要: An SRAM cell. The SRAM cell includes a first CMOS inverter and a second CMOS inverter, an input of the first inverter connected to an output of the second inverter and an input of the second inverter connected to an output of the first inverter, a first MOSFET interposed between an output of the first CMOS inverter and a first plate of a first capacitor, a second plate of the first capacitor connected to a high voltage terminal of a power supply; a second MOSFET interposed between an output of the second CMOS inverter and a first plate of a second capacitor, a second plate of the second capacitor connected to the high voltage terminal of the power supply; and a control signal line connected to a gate of the first MOSFET and a gate of the second MOSFET.

    摘要翻译: 一个SRAM单元。 SRAM单元包括第一CMOS反相器和第二CMOS反相器,连接到第二反相器的输出的第一反相器的输入和连接到第一反相器的输出的第二反相器的输入, 第一CMOS反相器的输出和第一电容器的第一板,第一电容器的第二板连接到电源的高电压端子; 插入在所述第二CMOS反相器的输出端和第二电容器的第一板之间的第二MOSFET,所述第二电容器的第二板连接到所述电源的高电压端子; 以及连接到第一MOSFET的栅极和第二MOSFET的栅极的控制信号线。

    Shallow trench isolation fill by liquid phase deposition of SiO2
    30.
    发明授权
    Shallow trench isolation fill by liquid phase deposition of SiO2 失效
    浅沟槽隔离填充SiO 2的液相沉积

    公开(公告)号:US07273794B2

    公开(公告)日:2007-09-25

    申请号:US10732953

    申请日:2003-12-11

    IPC分类号: H01L21/76

    摘要: To isolate two active regions formed on a silicon-on-insulator (SOI) substrate, a shallow trench isolation region is filled with liquid phase deposited silicon dioxide (LPD-SiO2) while avoiding covering the active areas with the oxide. By selectively depositing the oxide in this manner, the polishing needed to planarize the wafer is significantly reduced as compared to a chemical-vapor deposited oxide layer that covers the entire wafer surface. Additionally, the LPD-SiO2 does not include the growth seams that CVD silicon dioxide does. Accordingly, the etch rate of the LPD-SiO2 is uniform across its entire expanse thereby preventing cavities and other etching irregularities present in prior art shallow trench isolation regions in which the etch rate of growth seams exceeds that of the other oxide areas.

    摘要翻译: 为了隔离形成在绝缘体上硅(SOI)衬底上的两个有源区,浅沟槽隔离区填充有液相沉积二氧化硅(LPD-SiO 2),同时避免覆盖有源区 与氧化物。 通过以这种方式选择性地沉积氧化物,与覆盖整个晶片表面的化学气相沉积氧化物层相比,平坦化晶片所需的抛光显着降低。 此外,LPD-SiO 2不包括CVD二氧化硅的生长接缝。 因此,LPD-SiO 2的蚀刻速率在其整个宽度上是均匀的,从而防止存在于现有技术的浅沟槽隔离区域中的空穴和其它蚀刻不规则性,其中生长接缝的蚀刻速率超过 其他氧化物区域。