公开(公告)号：US20110095423A1

公开(公告)日：2011-04-28

申请号：US13000391

申请日：2009-10-27

申请人： Naomichi Ohashi ,  Shigeaki Sakatani ,  Arata Kishi ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

发明人： Naomichi Ohashi ,  Shigeaki Sakatani ,  Arata Kishi ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L23/49894 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13566 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/0105

摘要： A semiconductor device mounted structure includes a semiconductor device having a plurality first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it.

摘要翻译： 半导体器件安装结构包括具有多个第一电极的半导体器件，具有多个第二电极的电路板，分别形成在多个第一电极上的多个凸块，分别位于凸块和第二电极之间的多个接合部件 第二电极，经由凸块将第一电极与第二电极电连接;以及多个加强树脂部件，分别位于接合部件周围，以至少覆盖接合部件和接合部件与凸块之间的接合区域。 相邻的增强树脂构件彼此间隔开，以便不与半导体器件接触而彼此不接触。 该半导体器件安装结构提高了接头在耐冲击性方面的可靠性，并且使其易于修复。

公开(公告)号：US20100224398A1

公开(公告)日：2010-09-09

申请号：US12738430

申请日：2008-10-16

申请人： Koso Matsuno ,  Atsushi Yamaguchi ,  Shigeaki Sakatani ,  Hidenori Miyakawa ,  Mikiya Ueda

发明人： Koso Matsuno ,  Atsushi Yamaguchi ,  Shigeaki Sakatani ,  Hidenori Miyakawa ,  Mikiya Ueda

IPC分类号： H05K1/18

CPC分类号： H01L21/563 ,  H01L23/13 ,  H01L23/3121 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/15313 ,  H05K1/0224 ,  H05K3/28 ,  H05K3/3452 ,  H05K2201/0969 ,  H05K2201/0989 ,  H05K2201/10977

摘要： In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.

摘要翻译： 为了容易地注入底部填充树脂并且可靠地进行模制，在电路板的表面上形成槽部，使得槽部的端部延伸到半导体元件。 滴下的低粘度底部填充树脂由槽部引导，在电路基板与半导体元件之间流动。 底部填充树脂几乎不扩展到半导体元件外部的区域。

公开(公告)号：US20090277678A1

公开(公告)日：2009-11-12

申请号：US12431303

申请日：2009-04-28

申请人： Ryo KUWABARA ,  Atsushi YAMAGUCHI ,  Hidenori MIYAKAWA

发明人： Ryo KUWABARA ,  Atsushi YAMAGUCHI ,  Hidenori MIYAKAWA

IPC分类号： H05K1/16

CPC分类号： H05K3/305 ,  C08K3/34 ,  C09J163/00 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/10689 ,  Y02P70/613

摘要： A surface mount adhesive includes an epoxy resin, a curing agent, an accelerator, a first filler, and a second filler. The second filler has a specific gravity 1.1 to 3 times that of the first filler, and the second filler has a hardness higher than that of the first filler. The first filler has a largest particle size of 1 to 100 μm, and the second filler has a largest particle size of 1 to 100 μm, a specific gravity of 1.7 to 4.5, and a revised Mohs hardness of to 12. The weight ratio of the first filler to the second filler is from 1:3 to 3:1, and the surface mount adhesive has a specific gravity of 1.2 to 1.5. When the surface mount adhesive is dispensed, dispensing failures are suppressed, and dispensing stability is improved.

摘要翻译： 表面贴装粘合剂包括环氧树脂，固化剂，促进剂，第一填料和第二填料。 第二填料的比重为第一填料的比重为1.1〜3倍，第二填料的硬度比第一填料的硬度高。 第一填料的最大粒度为1-100μm，第二填料的最大粒度为1-100μm，比重为1.7〜4.5，修饰的莫氏硬度为12.重量比 第二填料的第一填料为1:3至3:1，表面粘合剂的比重为1.2至1.5。 当表面贴装粘合剂被分配时，抑制分配故障，并提高分配稳定性。

公开(公告)号：US09072204B2

公开(公告)日：2015-06-30

申请号：US13384502

申请日：2010-07-15

申请人： Ryo Kuwabara ,  Atsushi Yamaguchi ,  Masahiro Ono ,  Hidenori Miyakawa

发明人： Ryo Kuwabara ,  Atsushi Yamaguchi ,  Masahiro Ono ,  Hidenori Miyakawa

IPC分类号： H05K3/28 ,  H01L21/56 ,  H01L23/31 ,  H01L23/552 ,  H01L25/16 ,  H05K1/02 ,  H05K1/03

CPC分类号： H05K3/284 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/552 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0218 ,  H05K1/0313 ,  H05K2203/1316

摘要： An electronic module 10 includes: a circuit board 12 having a first surface and a second surface opposite the first surface; and a plurality of electronic components 14 mounted thereon. The electronic components 14 are sealed at the first surface of the circuit board 12, with a mold body 16 composed of a resin composition. A shield layer 28 is formed on the surface of the mold body 16. The glass transition temperature of a resin included in the mold body 16 is higher than the glass transition temperatures of resins included in the circuit board 12 and the shield layer 28, respectively. The modulus of elasticity of the mold body at 25° C. is 10 to 18 GPa, and the thickness of the circuit board is 0.3 to 1.0 mm.

摘要翻译： 电子模块10包括：具有第一表面和与第一表面相对的第二表面的电路板12; 以及安装在其上的多个电子部件14。 电子部件14被密封在电路板12的第一表面，模具体16由树脂组合物构成。 屏蔽层28形成在模体16的表面上。包括在模体16中的树脂的玻璃化转变温度分别高于包括在电路板12和屏蔽层28中的树脂的玻璃化转变温度 。 模具体在25℃下的弹性模量为10〜18GPa，电路基板的厚度为0.3〜1.0mm。

公开(公告)号：US08679635B2

公开(公告)日：2014-03-25

申请号：US13616401

申请日：2012-09-14

申请人： Atsushi Yamaguchi ,  Kazuhiro Nishikawa ,  Hidenori Miyakawa

发明人： Atsushi Yamaguchi ,  Kazuhiro Nishikawa ,  Hidenori Miyakawa

IPC分类号： B32B15/04 ,  C22C12/00

CPC分类号： H05K3/321 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  H01B1/22 ,  H05K3/3484 ,  Y10T403/479 ,  Y10T428/31678

摘要： Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.

摘要翻译： 公开了一种焊接材料，其能够在安装电子部件时实现较低的安装温度。 还公开了焊膏和导电粘合剂。 具体公开了具有由Sn，Bi和In构成的基本组成的焊料。 该焊料材料还可含有选自Cu，Ge和Ni中的至少一种金属。 可以通过将助焊剂成分混合到焊料材料中来获得能够实现低温安装的焊膏。 可以通过将树脂成分混合到焊料材料中来获得能够实现低温安装的导电粘合剂。

公开(公告)号：US08344268B2

公开(公告)日：2013-01-01

申请号：US12496017

申请日：2009-07-01

申请人： Hideyuki Tsujimura ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Hiroe Kowada ,  Koso Matsuno

发明人： Hideyuki Tsujimura ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Hiroe Kowada ,  Koso Matsuno

IPC分类号： H05K1/11

CPC分类号： H05K3/288 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2201/0989 ,  H05K2203/0783 ,  H05K2203/1322 ,  Y10T29/49146 ,  H01L2224/0401

摘要： An electronic component packaging structure includes a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or solubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.

摘要翻译： 电子部件封装结构包括电路板，安装在电路板上的电子部件和覆盖电子部件的防潮涂层。 防潮涂层由具有至少两层下层和上层的聚合物材料涂层构成，形成下层的聚合物材料具有较高的溶胀性和/或对所选择的修补溶剂的溶解性 与烃类溶剂相比，形成上层的聚合物材料。

公开(公告)号：US20100159719A1

公开(公告)日：2010-06-24

申请号：US12632270

申请日：2009-12-07

申请人： Ryo KUWABARA ,  Koso Matsuno ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

发明人： Ryo KUWABARA ,  Koso Matsuno ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

IPC分类号： H01R12/00

CPC分类号： H05K1/144 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10515 ,  H05K2201/2036

摘要： A package structure includes a first printed wiring board having mounted on a top surface a plurality of electronic components including at least one first electronic component, a second printed wiring board stacked on the top surface side of the first printed wiring board, and a plurality of connecting members for mechanically connecting the first and second printed wiring boards while maintaining a constant gap therebetween, the connecting members including a first cured resin for bonding a top surface of the at least one first electronic component to a bottom surface of the second printed wiring board.

摘要翻译： 封装结构包括：第一印刷线路板，其安装在顶表面上，多个电子部件包括至少一个第一电子部件，堆叠在第一印刷线路板的顶面侧的第二印刷线路板，以及多个 连接构件，用于机械地连接第一和第二印刷线路板，同时保持它们之间的恒定的间隙，所述连接构件包括用于将至少一个第一电子部件的顶表面接合到第二印刷线路板的底表面的第一固化树脂 。

公开(公告)号：US20100147567A1

公开(公告)日：2010-06-17

申请号：US12226872

申请日：2007-08-28

申请人： Hirohisa Hino ,  Taro Fukui ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Takayuki Higuchi

发明人： Hirohisa Hino ,  Taro Fukui ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Takayuki Higuchi

IPC分类号： H05K1/09 ,  B23K35/34

CPC分类号： C08K13/02 ,  C08K5/09 ,  C22C12/00 ,  C22C28/00 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y10T428/31511 ,  C08L63/00

摘要： The object of the invention is to provide a thermosetting resin composition which, in packaging an electronic circuit containing components incapable of withstanding elevated temperatures, employs low-melting solder particles, thereby enabling batch ref lowing and enabling packaging of components with excellent strength and toughness.The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond π electrons and is capable of coordinating with a metal.

摘要翻译： 本发明的目的是提供一种热固性树脂组合物，其在包含不能耐高温的组分的电子电路中使用低熔点焊料颗粒，从而能够批量降低并且能够包装具有优异的强度和韧性的组分。 本发明涉及包含金属填料组分，助熔组分和热固性树脂粘合剂的热固性树脂组合物。 金属填料组分包括铋（Bi）和铟（In）和锡（Sn）中的至少一种。 使用以下结构式（1）的化合物和下述结构式（2）的化合物中的至少一种的助熔组分。 在上式中，R 1〜R 6各自为氢或烷基，X为具有单电子对或双键的有机基团。 电子并且能够与金属配位。

公开(公告)号：US20100084174A1

公开(公告)日：2010-04-08

申请号：US12517311

申请日：2007-12-03

申请人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Kousou Matsuno

发明人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Kousou Matsuno

IPC分类号： H05K1/16 ,  H05K3/30 ,  C09J163/00

CPC分类号： H01L21/563 ,  C08G59/4021 ,  C08L63/00 ,  C09K3/10 ,  C09K2200/0645 ,  C09K2200/0647 ,  C09K2200/065 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  Y02P20/582 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49726 ,  H01L2924/00

摘要： A sealing material is provided which has sealing characteristics with low stress and high reliability upon mounting electronic parts on a board, and good repairablity after the sealing. The sealing material contains a heat-curable resin component and is characterized by ΔE/ΔT in a range of from 0.5 MPa/° C. to 30 MPa/° C. wherein ΔE/ΔT represents a ratio of change (ΔE) in storage elastic modulus (E) relative to a temperature change (ΔT) when the storage elastic modulus (E) is determined as the temperature is raised within a temperature range including a glass transition point (Tg) of the cured sealing material.

摘要翻译： 提供了一种密封材料，其在将电子部件安装在基板上时具有低应力和高可靠性的密封特性，并且在密封之后具有良好的可维修性。 密封材料含有热固性树脂组分，其特征在于：在0.5MPa /℃至30MPa /℃的范围内，其中＆Dgr; E /＆Dgr; T表示比例 的变化（＆Dgr; E）相对于温度变化（＆Dgr; T）的储存弹性模量（E），当储存弹性模量（E）在包括玻璃化转变点（Tg） ）固化的密封材料。

公开(公告)号：US20090269598A1

公开(公告)日：2009-10-29

申请号：US12427275

申请日：2009-04-21

申请人： Naomichi OHASHI ,  Hidenori MIYAKAWA ,  Atsushi YAMAGUCHI ,  Arata KISHI ,  Takayuki HIGUCHI

发明人： Naomichi OHASHI ,  Hidenori MIYAKAWA ,  Atsushi YAMAGUCHI ,  Arata KISHI ,  Takayuki HIGUCHI

IPC分类号： H01B1/22 ,  B32B15/08

CPC分类号： H01B1/22 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/36 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/3484 ,  H05K2201/0272 ,  Y10T428/31681 ,  H01L2224/05599

摘要： A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20° C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15° C. to 45° C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler.

摘要翻译： 导电浆料包括填料组分和助熔剂组分; 所述填充剂组分包括具有不同熔点的第一导电填料和第二导电填料，并且所述第一导电填料的熔点高于所述第二导电填料的熔点20℃或更高; 所述通量成分包括具有不同熔点的第一助熔剂和第二助熔剂，所述第一焊剂的熔点高于所述第二焊剂的熔点，所述第一焊剂的熔点高于所述熔点 第二导电填料15℃至45℃。 并且第二通量的熔点等于或小于第二导电填料的熔点。