公开(公告)号：US09095927B2

公开(公告)日：2015-08-04

申请号：US14237998

申请日：2012-07-26

申请人： Nobushiro Seo ,  Hisashi Hori

发明人： Nobushiro Seo ,  Hisashi Hori

IPC分类号： B23K20/12

CPC分类号： B23K20/1245 ,  B23K20/122 ,  B23K20/1225 ,  B23K20/1265 ,  B23K20/128

摘要： The invention aims at providing a friction stir welding method which can achieve joining a butting portion to a deep location therein by reducing the load on the friction stirring device. The friction stir welding method for joining two metal members (1) using a primary joining rotary tool (F) with a stirring pin (F2) includes a primary joining process in which a rotating stirring pin (F2) is moved to the butting portion formed by butting the metal members (1) against each other and friction stir welding is carried out. In the primary joining process, only the stirring pin (F2) is brought into contact with the metal members (1).

摘要翻译： 本发明的目的在于提供一种摩擦搅拌焊接方法，其可以通过减小摩擦搅拌装置的负荷来实现将对接部分连接到其深处。 将使用一次接合旋转工具（F）的两个金属构件（1）与搅拌销（F2）接合的摩擦搅拌焊接方法包括主旋转搅拌销（F2）移动到形成的对接部分的一次接合工艺 通过将金属构件（1）彼此对接并进行摩擦搅拌焊接。 在初次接合处理中，只有搅拌销（F2）与金属部件（1）接触。

公开(公告)号：US20140166731A1

公开(公告)日：2014-06-19

申请号：US14237998

申请日：2012-07-26

申请人： Nobushiro Seo ,  Hisashi Hori

发明人： Nobushiro Seo ,  Hisashi Hori

IPC分类号： B23K20/12

CPC分类号： B23K20/1245 ,  B23K20/122 ,  B23K20/1225 ,  B23K20/1265 ,  B23K20/128

摘要： The invention aims at providing a friction stir welding method which can achieve joining a butting portion to a deep location therein by reducing the load on the friction stirring device. The friction stir welding method for joining two metal members (1) using a primary joining rotary tool (F) with a stirring pin (F2) includes a primary joining process in which a rotating stirring pin (F2) is moved to the butting portion formed by butting the metal members (1) against each other and friction stir welding is carried out. In the primary joining process, only the stirring pin (F2) is brought into contact with the metal members (1).

摘要翻译： 本发明的目的在于提供一种摩擦搅拌焊接方法，其可以通过减小摩擦搅拌装置的负荷来实现将对接部分连接到其深处。 将使用一次接合旋转工具（F）的两个金属构件（1）与搅拌销（F2）接合的摩擦搅拌焊接方法包括主旋转搅拌销（F2）移动到形成的对接部分的一次接合工艺 通过将金属构件（1）彼此对接并进行摩擦搅拌焊接。 在初次接合处理中，只有搅拌销（F2）与金属部件（1）接触。

公开(公告)号：US20140037934A1

公开(公告)日：2014-02-06

申请号：US14112956

申请日：2012-07-11

申请人： Kaoru Ishido ,  Hideki Ishii ,  Shigehisa Watanabe ,  Hisashi Hori

发明人： Kaoru Ishido ,  Hideki Ishii ,  Shigehisa Watanabe ,  Hisashi Hori

IPC分类号： B22D19/14

CPC分类号： B22D19/14 ,  B22F2998/00 ,  C22C1/0416 ,  C22C1/10 ,  C22C21/00 ,  C22C21/02 ,  C22C29/065 ,  H01L23/3736 ,  H01L2924/0002 ,  Y10T428/249921 ,  B22F3/10 ,  B22F3/17 ,  H01L2924/00

摘要： There is provided a composite material for a heat dissipating plate which achieves both a high thermal conductivity and a low coefficient of thermal expansion and has a performance satisfactory as a heat dissipating plate and a method of production of a composite material which can produce the composite material at a low cost. For this reason, powder metallurgy is used to produce the composite material for a heat dissipating plate. The composite material for a heat dissipating plate which is fabricated by this method of production contains an aluminum alloy and silicon carbide. The particles of silicon carbide are in contact with each other.

摘要翻译： 提供了一种散热板的复合材料，其具有高导热性和低热膨胀系数，并且具有作为散热板的性能令人满意的效果，以及可以生产复合材料的复合材料的制造方法 以低成本。 因此，使用粉末冶金制造用于散热板的复合材料。 通过该制造方法制造的用于散热板的复合材料包含铝合金和碳化硅。 碳化硅颗粒彼此接触。

公开(公告)号：US08434662B2

公开(公告)日：2013-05-07

申请号：US13604177

申请日：2012-09-05

申请人： Hayato Sato ,  Hisashi Hori

发明人： Hayato Sato ,  Hisashi Hori

IPC分类号： B23K20/12

CPC分类号： B23K20/122 ,  B23K20/1225 ,  B23K20/124

摘要： A method of welding that realizes enhancements of airtightness and watertightness at a weld area and a method of welding and method of friction stir welding that attain an enhancement of welding operation efficiency/speed. There is provided a method of welding including the first primary welding step of carrying out a friction stir welding on the abutting portion (J1) of metal members (1,1) from the surface (12) side of metal member (1) and the second primary welding step of carrying out a friction stir welding on the abutting portion (J1) from the reverse face (13) side of the member (1), wherein in the second primary welding step, the friction stir welding is performed while penetrating a stirring pin (B2) of rotation tool (B) in plasticized region (W1) formed in the first primary welding step.

摘要翻译： 一种实现焊接区域的气密性和水密性的提高的焊接方法以及焊接方法和摩擦搅拌焊接方法，从而提高焊接作业效率/速度。 提供了一种焊接方法，包括：第一主要焊接步骤，从金属部件（1）的表面（12）侧在金属部件（1,1）的抵接部分（J1）上进行摩擦搅拌焊接;以及 从所述构件（1）的所述反面（13）侧在所述抵接部（J1）上进行摩擦搅拌焊接的第二主要焊接步骤，其中在所述第二主要焊接步骤中， 旋转工具（B）的搅拌销（B2）在形成于第一主要焊接步骤中的增塑区域（W1）中。

公开(公告)号：US20120325896A1

公开(公告)日：2012-12-27

申请号：US13604177

申请日：2012-09-05

申请人： Hayato SATO ,  Hisashi HORI

发明人： Hayato SATO ,  Hisashi HORI

IPC分类号： B23K20/12

CPC分类号： B23K20/122 ,  B23K20/1225 ,  B23K20/124

摘要： A method of welding that realizes enhancements of airtightness and watertightness at a weld area and a method of welding and method of friction stir welding that attain an enhancement of welding operation efficiency/speed. There is provided a method of welding including the first primary welding step of carrying out a friction stir welding on the abutting portion (J1) of metal members (1,1) from the surface (12) side of metal member (1) and the second primary welding step of carrying out a friction stir welding on the abutting portion (J1) from the reverse face (13) side of the member (1), wherein in the second primary welding step, the friction stir welding is performed while penetrating a stirring pin (B2) of rotation tool (B) in plasticized region (W1) formed in the first primary welding step.

摘要翻译： 一种实现焊接区域的气密性和水密性的提高的焊接方法以及焊接方法和摩擦搅拌焊接方法，从而提高焊接作业效率/速度。 提供了一种焊接方法，包括：第一主要焊接步骤，从金属部件（1）的表面（12）侧在金属部件（1,1）的抵接部分（J1）上进行摩擦搅拌焊接;以及 从所述构件（1）的所述反面（13）侧在所述抵接部（J1）上进行摩擦搅拌焊接的第二主要焊接步骤，其中在所述第二主要焊接步骤中， 旋转工具（B）的搅拌销（B2）在形成于第一主要焊接步骤中的增塑区域（W1）中。

公开(公告)号：US20120305292A1

公开(公告)日：2012-12-06

申请号：US13521928

申请日：2011-01-12

申请人： Hisashi Hori ,  Takanori Kokubo ,  Hideyo Osanai ,  Takayuki Takahashi ,  Kunihiko Chihara

发明人： Hisashi Hori ,  Takanori Kokubo ,  Hideyo Osanai ,  Takayuki Takahashi ,  Kunihiko Chihara

IPC分类号： H05K7/20 ,  B23K31/02

CPC分类号： H05K1/0201 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0058 ,  H01L2924/00

摘要： There is provide a liquid-cooled integrated substrate which has reduced material cost and processing cost, is reduced in warpage (shape deformation) as an integrated substrate, and has excellent strength and heat radiation performance, and a manufacturing method of the liquid-cooled integrated substrate. There is provided a liquid-cooled integrated substrate 1 in which a metal circuit board 15 made of aluminum or an aluminum alloy is bonded to one surface of a ceramic substrate 10, one surface of a plate-like metal base plate 20 made of aluminum or an aluminum alloy is bonded to another surface of the ceramic substrate 10, and a liquid-cooling type radiator 30 composed of an extrusion material is bonded to another surface of the metal base plate 20, wherein a relation between a thickness t1 of the metal circuit board 15 and a thickness t2 of the metal base plate 20 satisfies t2/t1≧2 where the thickness t1 of the metal circuit board 15 is 0.4 to 3 mm and the thickness t2 of the metal base plate 20 is 0.8 to 6 mm.

摘要翻译： 提供了一种液体冷却的一体化基板，其具有降低的材料成本和加工成本，减少作为一体基板的翘曲（形状变形），并且具有优异的强度和散热性能，以及液冷集成的制造方法 基质。 提供了一种液体冷却集成基板1，其中由铝或铝合金制成的金属电路板15结合在陶瓷基板10的一个表面上，由铝制成的板状金属基板20的一个表面 将铝合金结合到陶瓷基板10的另一表面，将由挤出材料构成的液冷式散热器30接合到金属基板20的另一个表面，其中金属电路的厚度t1 板15和金属基板20的厚度t2满足t2 /t1≥2，其中金属电路板15的厚度t1为0.4〜3mm，金属基板20的厚度t2为0.8〜6mm。

公开(公告)号：US20120279761A1

公开(公告)日：2012-11-08

申请号：US13521922

申请日：2011-01-12

申请人： Hisashi Hori ,  Hideyo Osanai ,  Takayuki Takahashi

发明人： Hisashi Hori ,  Hideyo Osanai ,  Takayuki Takahashi

IPC分类号： H05K7/20 ,  H05K13/04

CPC分类号： H01L23/473 ,  H01L21/4878 ,  H01L23/3735 ,  H01L2924/0002 ,  Y10T29/49144 ,  H01L2924/00

摘要： There is provide a manufacturing method of a fin-integrated substrate capable of producing by simple process a fin-integrated substrate with heat radiating fins at fine pitches by a processing method in which warpage of a metal base plate and corrugation (wavy shape) of the heat radiating fins are suppressed. There is provided a manufacturing method of a fin-integrated substrate in which bonding of the metal circuit board to the ceramic substrate is performed by a molten metal bonding method, and formation of the plurality of heat radiating fins at a cut part that is a part of the metal base plate is performed by fixing by a jig to apply a tensile stress on a surface of the cut part where the heat radiating fins are to be formed, and performing grooving processing of forming a plurality of grooves by moving a multi-cutter composed of a plurality of stacked disc-shaped cutters, on the surface to which the tensile stress is applied, while rotating the multi-cutter.

摘要翻译： 提供了一种翅片一体化基板的制造方法，其能够通过简单的工艺制造具有精细间距的散热翅片的翅片集成基板，其中金属基板的翘曲和波纹（波浪形） 散热片受到抑制。 提供了一种翅片一体化基板的制造方法，其中金属电路板与陶瓷基板的接合通过熔融金属接合方法进行，并且在作为部件的切割部分处形成多个散热片 通过夹具固定以在要形成散热片的切割部分的表面上施加拉伸应力，并且通过移动多切割器来进行形成多个凹槽的切槽加工 在多张切割器旋转的同时，在施加拉伸应力的表面上由多个堆叠的盘形切割器组成。

公开(公告)号：US5980684A

公开(公告)日：1999-11-09

申请号：US965437

申请日：1997-11-06

申请人： Hisashi Hori ,  Yoshitsugu Kawamura ,  Kazuto Obuchi

发明人： Hisashi Hori ,  Yoshitsugu Kawamura ,  Kazuto Obuchi

IPC分类号： H01L21/302 ,  C23C14/56 ,  H01L21/00 ,  H01L21/027 ,  H01L21/3065 ,  C23C16/00

CPC分类号： H01L21/67017 ,  C23C14/566

摘要： For shortening the time for introducing an inactive gas, such as nitrogen gas, into a load lock chamber of a processing apparatus for substrates, a buffer tank 19 having a capacity larger than that of the load lock chamber 3 is provided in the path of a pipe for introducing the nitrogen gas into the load lock chamber 3 of the processing apparatus. During processing within the processing chamber 2, such as an ashing process and so on, the nitrogen gas is introduced into the load lock chamber 3 from the buffer tank 19 by operating a valve mechanism 21 to increase the pressure within the load lock chamber 3 up to atmospheric pressure.

摘要翻译： 为了缩短将惰性气体（例如氮气）引入到用于基板的处理装置的装载锁定室中的时间，在容量大于载荷锁定室3的路径中设置有容量大于载荷锁定室3的缓冲罐19 用于将氮气引入到处理装置的装载锁定室3中的管道。 在处理室2内的加工过程中，例如灰化过程等，氮气通过操作阀机构21从缓冲罐19引入到装载锁定室3中，以将负载锁定室3内的压力升高 到大气压力。

公开(公告)号：US4165121A

公开(公告)日：1979-08-21

申请号：US829455

申请日：1977-08-31

申请人： Masaki Hori ,  Hisashi Hori

发明人： Masaki Hori ,  Hisashi Hori

IPC分类号： B62D33/027 ,  B60J5/10

CPC分类号： B62D33/0273 ,  Y10T16/84

摘要： In a device for opening and closing a side plate of a loading box on a motor truck under no-load condition wherein the side plate is outwardly openably hinged at its bottom edge to the outer side edge of the floor plate of the loading box, an actuating or interlocking mechanism is provided which comprises an upper actuating connecting rod and a lower actuating connecting rod. The upper actuating connecting rod has the upper end thereof articulated to the outer surface of the side plate and the lower end thereof articulated to the upper end of the lower actuating connecting rod, the lower end of which is articulated to a lower portion of a support member downwardly projected from the underside of the floor plate. Thus, the mechanism is twice-foldable. The actuating or interlocking mechanism may be resiliently pulled by a spring having the base thereof connected to the underside of the floor plate.