Method for sealing an electronic device containing a fluid material
    21.
    发明授权
    Method for sealing an electronic device containing a fluid material 失效
    密封包含流体材料的电子装置的方法

    公开(公告)号:US5008049A

    公开(公告)日:1991-04-16

    申请号:US410398

    申请日:1989-09-21

    摘要: A device containing a fluid material is sealed by sealant material placed essentially completely around the periphery of the device to join spaced apart first and second members of the device; and aperture is formed through the seal and the device interior is evacuated. Then fluid material is introduced into the device interior through the aperture and only a limited region of the device, confined substantially to the aperture is exposed to electromagnetic radiation from a laser or the like, to hermetically close the aperture when a photoreactive adhesive is injected into the aperture to cause the adhesive to solidify when contacted by the electromagnetic radiation. In an alternate embodiment, the aperture is filled with a plug of thermoplastic material, which is then selectively heat treated by a laser or the like to cause the plug to bind to the aperture boundary and hermetically enclose the fluid material.

    摘要翻译: 包含流体材料的装置由基本上完全围绕装置的周边放置的密封剂材料密封,以连接装置的间隔开的第一和第二构件; 并且通过密封件形成孔,并且将装置内部抽真空。 然后,流体材料通过孔被引入装置内部,并且仅当基本上限定在孔的受限区域暴露于来自激光器等的电磁辐射时,当将光反应粘合剂注入时气密地关闭孔 当电磁辐射接触时导致粘合剂固化的孔。 在替代实施例中,孔用一个热塑性材料塞填充,然后用激光等进行选择性热处理,以使塞子与孔口边界结合并气密地封闭流体材料。