公开(公告)号：US20050203658A1

公开(公告)日：2005-09-15

申请号：US10797824

申请日：2004-03-10

Applicant: Jen-Lin Chao ,  Chin-Yung Chang

Inventor： Jen-Lin Chao ,  Chin-Yung Chang

IPC: G06F19/00

CPC classification number: G06Q10/06

Abstract: A system and method of coinsurance wafer management. The system includes at least one production line and an order management unit. The production line processes a MPW shuttle including original wafers and coinsurance wafers with a common fabrication process before metal layering, processes the original wafers with different metal layering fabrication processes according to a metal layering technology of each device design of the MPW shuttle, and withholds the coinsurance wafers without further fabrication. The order management unit receives a request for a designated device design before a cutoff date, and the production line releases and processes coinsurance wafers with the metal layering fabrication process corresponding to the designated device design when the request is received.

Abstract translation: 一种共同保证晶片管理的系统和方法。 该系统包括至少一条生产线和订单管理单元。 该生产线在金属分层之前通过普通的制造工艺处理包括原始晶片和共晶保护晶片的MPW穿梭，根据MPW穿梭机的每种设备设计的金属分层技术处理具有不同金属分层制造工艺的原始晶片，并且保留 共同保证的晶片无需进一步制造。 订单管理单元在截止日期之前接收到指定的设备设计的请求，并且当接收到请求时，生产线释放并处理具有与指定的设备设计相对应的金属分层制造过程的共同保险晶片。