摘要:
A non-conformal integrated side shield structure is disclosed for a PMR write head wherein the sidewalls of the side shield are not parallel to the pole tip sidewalls. Thus, the side gap distance between the leading pole tip edge and side shield is different than the side gap distance between the trailing pole tip edge and side shield. As a result, there is a reduced side fringing field and improved overwrite performance. The side gap distance is constant with increasing distance from the ABS along the main pole layer. A fabrication method is provided where the trailing shield and side shield are formed in the same step to afford a self-aligned shield structure. Adjacent track erasure induced by flux choking at the side shield and trailing shield interface can be eliminated by this design. The invention encompasses a tapered main pole layer in a narrow pole tip section.
摘要:
A technique is disclosed that combines a bilayered photoresist structure, similar to that which is already in use in the MR head industry, with a post development UV irradiation treatment which reduces the manufacturable feature-size to be below the resolution limit. The technique is compatible with current manufacturing processes, requires no additional investment, and can be extended to ultra-small feature sizes.
摘要:
A method for forming a planar GMR read-head having a narrow read gap, a narrow track-width and being well insulated from its lower shield. The method requires the formation of a planarized bottom magnetic shield in which concave regions, symmetrically disposed about a track-width region, are filled with a layer of dielectric to provide added insulation. The dielectric filled shield is planarized and an additional planar dielectric layer, a thin planar GMR sensor layer and a planar PMGI layer of uniform thickness is formed on it. A layer of photoresist is deposited on the PMGI layer and a bi-layer lift-off stencil of uniform height above the GMR layer and symmetric overhang regions is formed. The uniformity of the lift-off stencil, which is a result of the planarity of the layers on which it is formed, allows the deposition of conductive lead and biasing layers with controlled overspread.