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公开(公告)号:US07215204B2
公开(公告)日:2007-05-08
申请号:US11055711
申请日:2005-02-10
CPC分类号: H01L24/49 , H01L24/48 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49175 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2924/30111 , H03F1/56 , H03F3/68 , H05K1/0203 , H05K1/0204 , H05K1/021 , H05K1/141 , H05K1/182 , H05K3/0061 , H05K3/3436 , H05K2201/10416 , H05K2203/049 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要: An amplifier module has a substrate, as assembly having one or more integrated circuit (IC) dies mounted to the substrate, and one or more other electronic components mounted to the substrate. The assembly receives an input signal and generates an amplified output signal. The one or more other electronic components perform one or more amplifier-related functions. The amplifier module is adapted to be mounted to a circuit board (CB) as a distinct electronic package. The invention may be implemented as an electronic system having the CB and at least one such amplifier module mounted to the CB.
摘要翻译: 放大器模块具有基板,作为具有安装到基板的一个或多个集成电路(IC)管芯的组件和安装到基板的一个或多个其它电子部件。 组件接收输入信号并产生放大的输出信号。 一个或多个其他电子部件执行一个或多个放大器相关功能。 放大器模块适于作为不同的电子封装安装到电路板(CB)。 本发明可以实现为具有CB和至少一个这样的放大器模块安装到CB的电子系统。