Multiple substrate
    22.
    发明授权
    Multiple substrate 失效
    多基板

    公开(公告)号:US5721044A

    公开(公告)日:1998-02-24

    申请号:US599234

    申请日:1996-02-09

    摘要: A multiple substrate is provided having a large area individual base layer with multiple substrates, for electrical circuits formed thereon. Individual substrates are defined by score lines in the base layer, and include a fragment of the base layer and at least one metal coating is provided on at least one surface of the fragment and has areas which stabilize the multiple substrates against unwanted breaking. Several individual substrates are preformed along peripheral sides of the base layer, and at least one metal coating on each individual substrate projects over the peripheral side.

    摘要翻译: 提供具有多个基板的大面积单独基底层的多基板,用于在其上形成的电路。 单个基底由基层中的刻痕线限定,并且包括基底层的片段,并且在片段的至少一个表面上提供至少一个金属涂层,并且具有稳定多个基底以防止不期望的破坏的区域。 几个单独的基底沿着基底层的周边预成型,并且每个单独的基底上的至少一个金属涂层突出在外围侧上。