Chimerized Wafer Boat for Use in Semiconductor Chip Processing and Related Methods
    23.
    发明申请
    Chimerized Wafer Boat for Use in Semiconductor Chip Processing and Related Methods 审中-公开
    用于半导体芯片处理和相关方法的嵌合晶片船

    公开(公告)号:US20110062053A1

    公开(公告)日:2011-03-17

    申请号:US12835399

    申请日:2010-07-13

    IPC分类号: B65D85/00 B31B3/00

    CPC分类号: H01L21/67313 H01L21/67316

    摘要: The invention provides a wafer boat for housing a semiconductor or a solar wafer that includes at least one wafer support member containing at least one slot capable of receiving at least a portion of a peripheral edge of a wafer, wherein in the wafer support member comprises silicon carbide; and at least one structural member for conveying the wafer boat into and out of a processing device connected to the wafer support member , wherein the structural member is comprised of a ceramic material that is not silicon carbide. Also included are methods of manufacturing a wafer boat having increased durability and/or chip resistance.

    摘要翻译: 本发明提供了一种用于容纳半导体或太阳能晶片的晶片舟,其包括至少一个晶片支撑构件,该至少一个晶片支撑构件包含至少一个能够接收晶片的外围边缘的至少一部分的槽,其中在晶片支撑构件中包括硅 碳化物; 以及至少一个结构构件,用于将晶片舟皿输送到连接到晶片支撑构件的处理装置中,其中,所述结构构件由不是碳化硅的陶瓷材料构成。 还包括制造具有增加的耐久性和/或芯片电阻的晶片舟的方法。